Photonic packaging in high-throughput microelectronic assembly lines for cost-efficiency and scalability

Tymon Barwicz; Yoichi Taira; Ted W. Lichoulas; Nicolas Boyer; Hidetoshi Numata; Yves Martin; Jae Woong Nah; Shotaro Takenobu; Alexander Janta-Polczynski; Eddie L. Kimbrell; Robert Leidy; Marwan Khater; Swetha Kamlapurkar; Sebastian Engelmann; Yurii A. Vlasov; Paul Fortier

Photonic packaging in high-throughput microelectronic assembly lines for cost-efficiency and scalability

Tymon Barwicz, Yoichi Taira, Ted W. Lichoulas, Nicolas Boyer, Hidetoshi Numata, Yves Martin, Jae Woong Nah, Shotaro Takenobu, Alexander Janta-Polczynski, Eddie L. Kimbrell, Robert Leidy, Marwan Khater, Swetha Kamlapurkar, Sebastian Engelmann, Yurii A. Vlasov, Paul Fortier

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

We demonstrate silicon photonic packaging that can be fully exercised in existing microelectronic packaging facilities. We show low optical loss and point towards notably improved assembly cost and scalability in both volume and optical port-count.

Original language	English (US)
Title of host publication	2015 Optical Fiber Communications Conference and Exhibition, OFC 2015
Publisher	Institute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)	9781557529374
State	Published - Jun 10 2015
Externally published	Yes
Event	2015 Optical Fiber Communications Conference and Exhibition, OFC 2015 - Los Angeles, United States Duration: Mar 22 2015 → Mar 26 2015

Publication series

Name	Conference on Optical Fiber Communication, Technical Digest Series
Volume	2015-June

Other

Other	2015 Optical Fiber Communications Conference and Exhibition, OFC 2015
Country	United States
City	Los Angeles
Period	3/22/15 → 3/26/15

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Electrical and Electronic Engineering

Fingerprint Dive into the research topics of 'Photonic packaging in high-throughput microelectronic assembly lines for cost-efficiency and scalability'. Together they form a unique fingerprint.

Cite this

Barwicz, T., Taira, Y., Lichoulas, T. W., Boyer, N., Numata, H., Martin, Y., Nah, J. W., Takenobu, S., Janta-Polczynski, A., Kimbrell, E. L., Leidy, R., Khater, M., Kamlapurkar, S., Engelmann, S., Vlasov, Y. A., & Fortier, P. (2015). Photonic packaging in high-throughput microelectronic assembly lines for cost-efficiency and scalability. In 2015 Optical Fiber Communications Conference and Exhibition, OFC 2015 [7122056] (Conference on Optical Fiber Communication, Technical Digest Series; Vol. 2015-June). Institute of Electrical and Electronics Engineers Inc..

Photonic packaging in high-throughput microelectronic assembly lines for cost-efficiency and scalability. / Barwicz, Tymon; Taira, Yoichi; Lichoulas, Ted W.; Boyer, Nicolas; Numata, Hidetoshi; Martin, Yves; Nah, Jae Woong; Takenobu, Shotaro; Janta-Polczynski, Alexander; Kimbrell, Eddie L.; Leidy, Robert; Khater, Marwan; Kamlapurkar, Swetha; Engelmann, Sebastian; Vlasov, Yurii A.; Fortier, Paul.

2015 Optical Fiber Communications Conference and Exhibition, OFC 2015. Institute of Electrical and Electronics Engineers Inc., 2015. 7122056 (Conference on Optical Fiber Communication, Technical Digest Series; Vol. 2015-June).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Barwicz, T, Taira, Y, Lichoulas, TW, Boyer, N, Numata, H, Martin, Y, Nah, JW, Takenobu, S, Janta-Polczynski, A, Kimbrell, EL, Leidy, R, Khater, M, Kamlapurkar, S, Engelmann, S, Vlasov, YA & Fortier, P 2015, Photonic packaging in high-throughput microelectronic assembly lines for cost-efficiency and scalability. in 2015 Optical Fiber Communications Conference and Exhibition, OFC 2015., 7122056, Conference on Optical Fiber Communication, Technical Digest Series, vol. 2015-June, Institute of Electrical and Electronics Engineers Inc., 2015 Optical Fiber Communications Conference and Exhibition, OFC 2015, Los Angeles, United States, 3/22/15.

Barwicz T, Taira Y, Lichoulas TW, Boyer N, Numata H, Martin Y et al. Photonic packaging in high-throughput microelectronic assembly lines for cost-efficiency and scalability. In 2015 Optical Fiber Communications Conference and Exhibition, OFC 2015. Institute of Electrical and Electronics Engineers Inc. 2015. 7122056. (Conference on Optical Fiber Communication, Technical Digest Series).

Barwicz, Tymon ; Taira, Yoichi ; Lichoulas, Ted W. ; Boyer, Nicolas ; Numata, Hidetoshi ; Martin, Yves ; Nah, Jae Woong ; Takenobu, Shotaro ; Janta-Polczynski, Alexander ; Kimbrell, Eddie L. ; Leidy, Robert ; Khater, Marwan ; Kamlapurkar, Swetha ; Engelmann, Sebastian ; Vlasov, Yurii A. ; Fortier, Paul. / Photonic packaging in high-throughput microelectronic assembly lines for cost-efficiency and scalability. 2015 Optical Fiber Communications Conference and Exhibition, OFC 2015. Institute of Electrical and Electronics Engineers Inc., 2015. (Conference on Optical Fiber Communication, Technical Digest Series).

@inproceedings{41ce960cbdb44032a05e2e32f732dcf5,

title = "Photonic packaging in high-throughput microelectronic assembly lines for cost-efficiency and scalability",

abstract = "We demonstrate silicon photonic packaging that can be fully exercised in existing microelectronic packaging facilities. We show low optical loss and point towards notably improved assembly cost and scalability in both volume and optical port-count.",

author = "Tymon Barwicz and Yoichi Taira and Lichoulas, {Ted W.} and Nicolas Boyer and Hidetoshi Numata and Yves Martin and Nah, {Jae Woong} and Shotaro Takenobu and Alexander Janta-Polczynski and Kimbrell, {Eddie L.} and Robert Leidy and Marwan Khater and Swetha Kamlapurkar and Sebastian Engelmann and Vlasov, {Yurii A.} and Paul Fortier",

year = "2015",

month = jun,

day = "10",

language = "English (US)",

series = "Conference on Optical Fiber Communication, Technical Digest Series",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

booktitle = "2015 Optical Fiber Communications Conference and Exhibition, OFC 2015",

address = "United States",

note = "2015 Optical Fiber Communications Conference and Exhibition, OFC 2015 ; Conference date: 22-03-2015 Through 26-03-2015",

}

TY - GEN

T1 - Photonic packaging in high-throughput microelectronic assembly lines for cost-efficiency and scalability

AU - Barwicz, Tymon

AU - Taira, Yoichi

AU - Lichoulas, Ted W.

AU - Boyer, Nicolas

AU - Numata, Hidetoshi

AU - Martin, Yves

AU - Nah, Jae Woong

AU - Takenobu, Shotaro

AU - Janta-Polczynski, Alexander

AU - Kimbrell, Eddie L.

AU - Leidy, Robert

AU - Khater, Marwan

AU - Kamlapurkar, Swetha

AU - Engelmann, Sebastian

AU - Vlasov, Yurii A.

AU - Fortier, Paul

PY - 2015/6/10

Y1 - 2015/6/10

N2 - We demonstrate silicon photonic packaging that can be fully exercised in existing microelectronic packaging facilities. We show low optical loss and point towards notably improved assembly cost and scalability in both volume and optical port-count.

AB - We demonstrate silicon photonic packaging that can be fully exercised in existing microelectronic packaging facilities. We show low optical loss and point towards notably improved assembly cost and scalability in both volume and optical port-count.

UR - http://www.scopus.com/inward/record.url?scp=84945207364&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84945207364&partnerID=8YFLogxK

M3 - Conference contribution

AN - SCOPUS:84945207364

T3 - Conference on Optical Fiber Communication, Technical Digest Series

BT - 2015 Optical Fiber Communications Conference and Exhibition, OFC 2015

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 2015 Optical Fiber Communications Conference and Exhibition, OFC 2015

Y2 - 22 March 2015 through 26 March 2015

ER -