@inproceedings{41ce960cbdb44032a05e2e32f732dcf5,
title = "Photonic packaging in high-throughput microelectronic assembly lines for cost-efficiency and scalability",
abstract = "We demonstrate silicon photonic packaging that can be fully exercised in existing microelectronic packaging facilities. We show low optical loss and point towards notably improved assembly cost and scalability in both volume and optical port-count.",
author = "Tymon Barwicz and Yoichi Taira and Lichoulas, {Ted W.} and Nicolas Boyer and Hidetoshi Numata and Yves Martin and Nah, {Jae Woong} and Shotaro Takenobu and Alexander Janta-Polczynski and Kimbrell, {Eddie L.} and Robert Leidy and Marwan Khater and Swetha Kamlapurkar and Sebastian Engelmann and Vlasov, {Yurii A.} and Paul Fortier",
year = "2015",
month = jun,
day = "10",
language = "English (US)",
series = "Conference on Optical Fiber Communication, Technical Digest Series",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
booktitle = "2015 Optical Fiber Communications Conference and Exhibition, OFC 2015",
address = "United States",
note = "2015 Optical Fiber Communications Conference and Exhibition, OFC 2015 ; Conference date: 22-03-2015 Through 26-03-2015",
}