Photonic packaging in high-throughput microelectronic assembly lines for cost-efficiency and scalability

Tymon Barwicz; Yoichi Taira; Ted W. Lichoulas; Nicolas Boyer; Hidetoshi Numata; Yves Martin; Jae Woong Nah; Shotaro Takenobu; Alexander Janta-Polczynski; Eddie L. Kimbrell; Robert Leidy; Marwan Khater; Swetha Kamlapurkar; Sebastian Engelmann; Yurii A. Vlasov; Paul Fortier

Photonic packaging in high-throughput microelectronic assembly lines for cost-efficiency and scalability

Tymon Barwicz, Yoichi Taira, Ted W. Lichoulas, Nicolas Boyer, Hidetoshi Numata, Yves Martin, Jae Woong Nah, Shotaro Takenobu, Alexander Janta-Polczynski, Eddie L. Kimbrell, Robert Leidy, Marwan Khater, Swetha Kamlapurkar, Sebastian Engelmann, Yurii A. Vlasov, Paul Fortier

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

We demonstrate silicon photonic packaging that can be fully exercised in existing microelectronic packaging facilities. We show low optical loss and point towards notably improved assembly cost and scalability in both volume and optical port-count.

Original language	English (US)
Title of host publication	2015 Optical Fiber Communications Conference and Exhibition, OFC 2015
Publisher	Institute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)	9781557529374
State	Published - Jun 10 2015
Externally published	Yes
Event	2015 Optical Fiber Communications Conference and Exhibition, OFC 2015 - Los Angeles, United States Duration: Mar 22 2015 → Mar 26 2015

Publication series

Name	Conference on Optical Fiber Communication, Technical Digest Series
Volume	2015-June

Other

Other	2015 Optical Fiber Communications Conference and Exhibition, OFC 2015
Country	United States
City	Los Angeles
Period	3/22/15 → 3/26/15

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Electrical and Electronic Engineering

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Barwicz, T., Taira, Y., Lichoulas, T. W., Boyer, N., Numata, H., Martin, Y., Nah, J. W., Takenobu, S., Janta-Polczynski, A., Kimbrell, E. L., Leidy, R., Khater, M., Kamlapurkar, S., Engelmann, S., Vlasov, Y. A., & Fortier, P. (2015). Photonic packaging in high-throughput microelectronic assembly lines for cost-efficiency and scalability. In 2015 Optical Fiber Communications Conference and Exhibition, OFC 2015 [7122056] (Conference on Optical Fiber Communication, Technical Digest Series; Vol. 2015-June). Institute of Electrical and Electronics Engineers Inc..

Photonic packaging in high-throughput microelectronic assembly lines for cost-efficiency and scalability. / Barwicz, Tymon; Taira, Yoichi; Lichoulas, Ted W.; Boyer, Nicolas; Numata, Hidetoshi; Martin, Yves; Nah, Jae Woong; Takenobu, Shotaro; Janta-Polczynski, Alexander; Kimbrell, Eddie L.; Leidy, Robert; Khater, Marwan; Kamlapurkar, Swetha; Engelmann, Sebastian; Vlasov, Yurii A.; Fortier, Paul.

2015 Optical Fiber Communications Conference and Exhibition, OFC 2015. Institute of Electrical and Electronics Engineers Inc., 2015. 7122056 (Conference on Optical Fiber Communication, Technical Digest Series; Vol. 2015-June).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Barwicz, T, Taira, Y, Lichoulas, TW, Boyer, N, Numata, H, Martin, Y, Nah, JW, Takenobu, S, Janta-Polczynski, A, Kimbrell, EL, Leidy, R, Khater, M, Kamlapurkar, S, Engelmann, S, Vlasov, YA & Fortier, P 2015, Photonic packaging in high-throughput microelectronic assembly lines for cost-efficiency and scalability. in 2015 Optical Fiber Communications Conference and Exhibition, OFC 2015., 7122056, Conference on Optical Fiber Communication, Technical Digest Series, vol. 2015-June, Institute of Electrical and Electronics Engineers Inc., 2015 Optical Fiber Communications Conference and Exhibition, OFC 2015, Los Angeles, United States, 3/22/15.

Barwicz T, Taira Y, Lichoulas TW, Boyer N, Numata H, Martin Y et al. Photonic packaging in high-throughput microelectronic assembly lines for cost-efficiency and scalability. In 2015 Optical Fiber Communications Conference and Exhibition, OFC 2015. Institute of Electrical and Electronics Engineers Inc. 2015. 7122056. (Conference on Optical Fiber Communication, Technical Digest Series).

Barwicz, Tymon ; Taira, Yoichi ; Lichoulas, Ted W. ; Boyer, Nicolas ; Numata, Hidetoshi ; Martin, Yves ; Nah, Jae Woong ; Takenobu, Shotaro ; Janta-Polczynski, Alexander ; Kimbrell, Eddie L. ; Leidy, Robert ; Khater, Marwan ; Kamlapurkar, Swetha ; Engelmann, Sebastian ; Vlasov, Yurii A. ; Fortier, Paul. / Photonic packaging in high-throughput microelectronic assembly lines for cost-efficiency and scalability. 2015 Optical Fiber Communications Conference and Exhibition, OFC 2015. Institute of Electrical and Electronics Engineers Inc., 2015. (Conference on Optical Fiber Communication, Technical Digest Series).

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AU - Martin, Yves

AU - Nah, Jae Woong

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AU - Kimbrell, Eddie L.

AU - Leidy, Robert

AU - Khater, Marwan

AU - Kamlapurkar, Swetha

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AU - Vlasov, Yurii A.

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