Photonic packaging in high-throughput microelectronic assembly lines for cost-efficiency and scalability

Tymon Barwicz, Yoichi Taira, Ted W. Lichoulas, Nicolas Boyer, Hidetoshi Numata, Yves Martin, Jae Woong Nah, Shotaro Takenobu, Alexander Janta-Polczynski, Eddie L. Kimbrell, Robert Leidy, Marwan Khater, Swetha Kamlapurkar, Sebastian Engelmann, Yurii A. Vlasov, Paul Fortier

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

We demonstrate silicon photonic packaging that can be fully exercised in existing microelectronic packaging facilities. We show low optical loss and point towards notably improved assembly cost and scalability in both volume and optical port-count.

Original languageEnglish (US)
Title of host publication2015 Optical Fiber Communications Conference and Exhibition, OFC 2015
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781557529374
StatePublished - Jun 10 2015
Externally publishedYes
Event2015 Optical Fiber Communications Conference and Exhibition, OFC 2015 - Los Angeles, United States
Duration: Mar 22 2015Mar 26 2015

Publication series

NameConference on Optical Fiber Communication, Technical Digest Series
Volume2015-June

Other

Other2015 Optical Fiber Communications Conference and Exhibition, OFC 2015
CountryUnited States
CityLos Angeles
Period3/22/153/26/15

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

Fingerprint Dive into the research topics of 'Photonic packaging in high-throughput microelectronic assembly lines for cost-efficiency and scalability'. Together they form a unique fingerprint.

  • Cite this

    Barwicz, T., Taira, Y., Lichoulas, T. W., Boyer, N., Numata, H., Martin, Y., Nah, J. W., Takenobu, S., Janta-Polczynski, A., Kimbrell, E. L., Leidy, R., Khater, M., Kamlapurkar, S., Engelmann, S., Vlasov, Y. A., & Fortier, P. (2015). Photonic packaging in high-throughput microelectronic assembly lines for cost-efficiency and scalability. In 2015 Optical Fiber Communications Conference and Exhibition, OFC 2015 [7122056] (Conference on Optical Fiber Communication, Technical Digest Series; Vol. 2015-June). Institute of Electrical and Electronics Engineers Inc..