Abstract
Photosensitive, dielectric insulating, crosslinkable copolyester films used as dielectric and as photoresist films for microelectronics circuits which are also suitable for use in producing MCM-L packages. In various embodiments of the invention there is provided photosensitive, dielectric insulating, crosslinkable copolyester film forming mixtures for coating onto microelectronics substrate surfaces, a photosensitive oligomer for producing the crosslinkable copolyesters and MCM-L products produced using the crosslinked copolyesters.
| Original language | English (US) |
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| U.S. patent number | 5707782 |
| Filing date | 3/1/96 |
| State | Published - Jan 13 1998 |