Phase identification of intermetallic compounds formed during in-48Sn/Cu soldering reactions

P. J. Shang, Z. Q. Liu, D. X. Li, Jian Ku Shang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Transmission electron microscope observations and precise diffraction analyses were performed on the interfacial reaction between In-48Sn and Cu at the temperature range from 160°C to 250°C for up to 90 minutes. The results indicated that two different morphologies formed between In-48Sn and Cu at the temperature below 200°C: small-grain Cu2(In,Sn) at the Cu side and large-grain Cu2(In,Sn) at the solder side. If the soldering temperature is above 200°C, the Cu6(In,Sn)5 phase is the first phase formed at the solder/Cu interface. However, the subsequent solid-state diffusion of In and Sn atoms through the initial Cu 6(In,Sn)5 layer drove the formation of Cu 9(In,Sn)4 phase between Cu6(In,Sn)5 and Cu substrate.

Original languageEnglish (US)
Title of host publication2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009
Pages597-600
Number of pages4
DOIs
StatePublished - Nov 25 2009
Event2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009 - Beijing, China
Duration: Aug 10 2009Aug 13 2009

Publication series

Name2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009

Other

Other2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009
Country/TerritoryChina
CityBeijing
Period8/10/098/13/09

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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