Keyphrases
Electronic Devices
100%
Electronics Thermal Management
100%
Phase Change Material
100%
Transient Thermal Management
100%
Integrated Cooling
100%
Finite Element Simulation
25%
Operating Conditions
25%
Integrated Device
25%
Cooling Performance
25%
Effective Cooling
25%
Heating Condition
25%
Temperature Range
12%
Melting Temperature
12%
Temperature Effect
12%
Maximum Temperature
12%
Heat Flow
12%
Heat Transfer
12%
Input Conditions
12%
Cooling Conditions
12%
Reduced Order Model
12%
Pulse Train
12%
Single Pulse
12%
Circuit Board
12%
Integrated Thermal Management
12%
Power Cooling
12%
Power Device
12%
Material Optimization
12%
Field's Metal
12%
Operation Range
12%
Power Input
12%
Transient Operation
12%
Temperature Reduction
12%
Fast Calculation
12%
Junction Temperature
12%
3D FEM
12%
Cooling Capacity
12%
Heat Spreader
12%
High Latent Heat
12%
Integrated Power
12%
Thermal Management Applications
12%
Thermal Management System
12%
Copper Foam
12%
Temperature Swing
12%
Gallium Nitride Device
12%
Thermal Buffer
12%
Phase Change Dynamics
12%
Junction Temperature Swing
12%
Varying Working Conditions
12%
Phase Transition Heat
12%
Foam Composite
12%
Engineering
Transients
100%
Phase Change Material
100%
Cooling Performance
25%
Junction Temperature
25%
Finite Element Analysis
25%
Integrated Circuit
25%
Broad Range
12%
Temperature Range
12%
Constrains
12%
Latent Heat
12%
Nitride
12%
Temperature Response
12%
Maximum Temperature
12%
Melting Temperature
12%
Input Condition
12%
Reduced Order Model
12%
Pulse Train
12%
Power Device
12%
Single Pulse
12%
Material Optimisation
12%
Cooling Capacity
12%
Power Input
12%
Cooling Condition
12%
Melting Point
12%
Chemical Engineering
Gallium Nitride
100%
High Latent Heat
100%
Material Science
Phase Change Material
100%
Finite Element Method
25%
Electronic Circuit
12%
Gallium Nitride
12%
Power Device
12%
Field's Metal
12%
Composite Material
12%