TY - GEN
T1 - Perspectives and challenges in 111-V devices and system-level integration for future wireless applications
AU - Schutt-Aine, Jose
AU - Feng, Milton
N1 - Publisher Copyright:
© 2003 IEEE.
PY - 2003
Y1 - 2003
N2 - The performance of radio frequency (RF) integrated circuits will strongly influence the versatility and portability of future wireless communication systems. Next-generation wireless technologies promise to deliver substantial improvements in size, weight, portability, power consumption and cost. They will also integrate many. different functions including not only voice but also video, data which will give birth to a variety of communication devices such as personal digital assistant, automobile navigation, and even vending machines. The worldwide wireless communications market is expected to grow in the next few years with sales of 500 million handsets and revenues of $5 billion for WLAN equipment predicted for 2005. In addition, with the advent of newer modulation schemes such as EDGE as a gateway for 3G, major changes are expected to take place in the infrastructure. These new directions and infrastructure changes present a unique opportunity for academic research in several core technology areas. In particular, research in materials technology, system-level integration, modeling and computer-aided design (CAD) support have potentials for making a serious impact and help enable the advent of this new wireless age. Several challenges must however be surmounted in order to make this possible.
AB - The performance of radio frequency (RF) integrated circuits will strongly influence the versatility and portability of future wireless communication systems. Next-generation wireless technologies promise to deliver substantial improvements in size, weight, portability, power consumption and cost. They will also integrate many. different functions including not only voice but also video, data which will give birth to a variety of communication devices such as personal digital assistant, automobile navigation, and even vending machines. The worldwide wireless communications market is expected to grow in the next few years with sales of 500 million handsets and revenues of $5 billion for WLAN equipment predicted for 2005. In addition, with the advent of newer modulation schemes such as EDGE as a gateway for 3G, major changes are expected to take place in the infrastructure. These new directions and infrastructure changes present a unique opportunity for academic research in several core technology areas. In particular, research in materials technology, system-level integration, modeling and computer-aided design (CAD) support have potentials for making a serious impact and help enable the advent of this new wireless age. Several challenges must however be surmounted in order to make this possible.
UR - https://www.scopus.com/pages/publications/84947809363
UR - https://www.scopus.com/pages/publications/84947809363#tab=citedBy
U2 - 10.1109/WCT.2003.1321443
DO - 10.1109/WCT.2003.1321443
M3 - Conference contribution
AN - SCOPUS:84947809363
T3 - 2003 IEEE Topical Conference on Wireless Communication Technology
SP - 94
EP - 96
BT - 2003 IEEE Topical Conference on Wireless Communication Technology
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - IEEE Topical Conference on Wireless Communication Technology
Y2 - 15 October 2003 through 17 October 2003
ER -