The performance of radio frequency (RF) integrated circuits will strongly influence the versatility and portability of future wireless communication systems. Next-generation wireless technologies promise to deliver substantial improvements in size, weight, portability, power consumption and cost. They will also integrate many. different functions including not only voice but also video, data which will give birth to a variety of communication devices such as personal digital assistant, automobile navigation, and even vending machines. The worldwide wireless communications market is expected to grow in the next few years with sales of 500 million handsets and revenues of $5 billion for WLAN equipment predicted for 2005. In addition, with the advent of newer modulation schemes such as EDGE as a gateway for 3G, major changes are expected to take place in the infrastructure. These new directions and infrastructure changes present a unique opportunity for academic research in several core technology areas. In particular, research in materials technology, system-level integration, modeling and computer-aided design (CAD) support have potentials for making a serious impact and help enable the advent of this new wireless age. Several challenges must however be surmounted in order to make this possible.