Perspective on thermal conductance across heterogeneously integrated interfaces for wide and ultrawide bandgap electronics

Heterogeneous integration is important to create multi-functionality in future electronic devices. However, few thermal studies of the interfaces formed in these integrated devices have been reported before. Recently, integrated interfaces by surface-Activated bonding were found to have high thermal boundary conductance, which provides a solution for heat dissipation of GaN and β-Ga2O3-based power electronics. Here, we review the recent progress on the interfacial thermal transport across heterogeneously integrated interfaces, including transferred van der Waals force bonded interfaces, surface-Activated bonded interfaces, plasma bonded interfaces, and hydrophilic bonded interfaces. This Perspective specifically focuses on applications of thermal management strategies of electronics, especially power electronics. Finally, the challenges, such as high-Throughput thermal measurements of buried interfaces, thermal property-structure relations of interfaces bonded under different conditions, theoretical understanding of interfacial thermal transport, and device demonstrations, are pointed out.