PERFORMANCE VALIDATION of VOLTAGE BLOCKING TECHNOLOGIES for DIRECT COOLING of HIGH-DENSITY POWER ELECTRONICS

Ange Christian Iradukunda, David Huitink, Tarek Gebrael, Nenad Miljkovic

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The voltage shielding capacity of a hydrofluoroether type fluid, specifically HFE7500 along with that of Parylene C based conformal surface coatings are explored. Both voltage blocking technologies demonstrated an ability to maintain good voltage blocking capacity even when exposed to field strengths as high as 16.8kV/mm in the case of the dielectric fluid and 33.5 kV/mm for 2μm-thick layers of Parylene C. To potentially improve voltage blocking characteristics while minimizing thermal resistance, this study also explores the combined voltage shielding capacity of HFE7500 coupled with thin Parylene C coatings deposited via chemical vapor deposition (CVD). Breakdown tests on point-point electrodes coated with a 10μm film of this coating returned results that showed diminished breakdown voltage compared to bare electrodes. This may be attributed to several factors including the ionization of the coating that initiates breakdown at a reduced field strength.

Original languageEnglish (US)
Title of host publicationProceedings of ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2022
PublisherAmerican Society of Mechanical Engineers (ASME)
ISBN (Electronic)9780791886557
DOIs
StatePublished - 2022
EventASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2022 - Garden Grove, United States
Duration: Oct 25 2022Oct 27 2022

Publication series

NameProceedings of ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2022

Conference

ConferenceASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2022
Country/TerritoryUnited States
CityGarden Grove
Period10/25/2210/27/22

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

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