Performance of self-healing epoxy with microencapsulated healing agent and shape memory alloy wires

E. L. Kirkby; V. J. Michaud; J. A.E. Månson; N. R. Sottos; S. R. White

doi:10.1016/j.polymer.2009.05.014

Performance of self-healing epoxy with microencapsulated healing agent and shape memory alloy wires

E. L. Kirkby
, V. J. Michaud
, J. A.E. Månson
, N. R. Sottos
, S. R. White

Research output: Contribution to journal › Article › peer-review

Abstract

We report the first measurements of a self-healing polymer that combines a microencapsulated liquid healing agent and shape memory alloy (SMA) wires. When a propagating crack ruptures the embedded microcapsules, the liquid healing agent is automatically released into the crack where it contacts a solid catalyst embedded in the matrix. The SMA wires are then activated to close the crack during the healing period. We show that dramatically improved healing performance is obtained by the activation of embedded SMA wires. We conclude that improved healing is due to a reduction of crack volume as a result of pulling the crack faces closed, and more complete polymerization of the healing agent due to the heat produced by the activated SMA wires.

Original language	English (US)
Pages (from-to)	5533-5538
Number of pages	6
Journal	Polymer
Volume	50
Issue number	23
DOIs	https://doi.org/10.1016/j.polymer.2009.05.014
State	Published - Nov 3 2009

Keywords

Microcapsule
Self-healing polymer
Shape memory alloy wire

ASJC Scopus subject areas

Organic Chemistry
Polymers and Plastics

Online availability

10.1016/j.polymer.2009.05.014

Library availability

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title = "Performance of self-healing epoxy with microencapsulated healing agent and shape memory alloy wires",

abstract = "We report the first measurements of a self-healing polymer that combines a microencapsulated liquid healing agent and shape memory alloy (SMA) wires. When a propagating crack ruptures the embedded microcapsules, the liquid healing agent is automatically released into the crack where it contacts a solid catalyst embedded in the matrix. The SMA wires are then activated to close the crack during the healing period. We show that dramatically improved healing performance is obtained by the activation of embedded SMA wires. We conclude that improved healing is due to a reduction of crack volume as a result of pulling the crack faces closed, and more complete polymerization of the healing agent due to the heat produced by the activated SMA wires.",

keywords = "Microcapsule, Self-healing polymer, Shape memory alloy wire",

author = "Kirkby, \{E. L.\} and Michaud, \{V. J.\} and M{\aa}nson, \{J. A.E.\} and Sottos, \{N. R.\} and White, \{S. R.\}",

note = "The authors gratefully acknowledge the financial support of the Swiss National Science Foundation (contract no. 200020-105169) and of AFOSR Aerospace and Material Science Directorate (grant no. FA9550-05-1-0346). Scott Robinson at the Imaging Technology Group, Beckman Institute of UIUC and Claire Delabarde at the Laboratoire de Technologie des Composites et Polym{\`e}res, EPFL are thanked for their assistance with scanning electron microscopy.",

year = "2009",

month = nov,

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doi = "10.1016/j.polymer.2009.05.014",

language = "English (US)",

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journal = "Polymer",

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TY - JOUR

T1 - Performance of self-healing epoxy with microencapsulated healing agent and shape memory alloy wires

AU - Kirkby, E. L.

AU - Michaud, V. J.

AU - Månson, J. A.E.

AU - Sottos, N. R.

AU - White, S. R.

N1 - The authors gratefully acknowledge the financial support of the Swiss National Science Foundation (contract no. 200020-105169) and of AFOSR Aerospace and Material Science Directorate (grant no. FA9550-05-1-0346). Scott Robinson at the Imaging Technology Group, Beckman Institute of UIUC and Claire Delabarde at the Laboratoire de Technologie des Composites et Polymères, EPFL are thanked for their assistance with scanning electron microscopy.

PY - 2009/11/3

Y1 - 2009/11/3

N2 - We report the first measurements of a self-healing polymer that combines a microencapsulated liquid healing agent and shape memory alloy (SMA) wires. When a propagating crack ruptures the embedded microcapsules, the liquid healing agent is automatically released into the crack where it contacts a solid catalyst embedded in the matrix. The SMA wires are then activated to close the crack during the healing period. We show that dramatically improved healing performance is obtained by the activation of embedded SMA wires. We conclude that improved healing is due to a reduction of crack volume as a result of pulling the crack faces closed, and more complete polymerization of the healing agent due to the heat produced by the activated SMA wires.

AB - We report the first measurements of a self-healing polymer that combines a microencapsulated liquid healing agent and shape memory alloy (SMA) wires. When a propagating crack ruptures the embedded microcapsules, the liquid healing agent is automatically released into the crack where it contacts a solid catalyst embedded in the matrix. The SMA wires are then activated to close the crack during the healing period. We show that dramatically improved healing performance is obtained by the activation of embedded SMA wires. We conclude that improved healing is due to a reduction of crack volume as a result of pulling the crack faces closed, and more complete polymerization of the healing agent due to the heat produced by the activated SMA wires.

KW - Microcapsule

KW - Self-healing polymer

KW - Shape memory alloy wire

UR - https://www.scopus.com/pages/publications/70350482297

UR - https://www.scopus.com/pages/publications/70350482297#tab=citedBy

U2 - 10.1016/j.polymer.2009.05.014

DO - 10.1016/j.polymer.2009.05.014

M3 - Article

AN - SCOPUS:70350482297

SN - 0032-3861

VL - 50

SP - 5533

EP - 5538

JO - Polymer

JF - Polymer

IS - 23

ER -

Performance of self-healing epoxy with microencapsulated healing agent and shape memory alloy wires

Abstract

Keywords

ASJC Scopus subject areas

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