TY - GEN
T1 - Performance and power evaluation of a 3D CMOS/Nanomaterial reconfigurable architecture
AU - Dong, Chen
AU - Chen, Deming
AU - Tanachutiwat, Sansiri
AU - Wang, Wei
N1 - Copyright:
Copyright 2011 Elsevier B.V., All rights reserved.
PY - 2007
Y1 - 2007
N2 - In this paper, we introduce a novel reconfigurable architecture, named 3D nFPGA, which utilizes 3D integration techniques and new nanoscale materials synergistically. The proposed architecture is based on CMOS-nano hybrid techniques that incorporate nanomaterials such as carbon nanotube bundles and nanowire crossbars into CMOS fabrication process. Using unique features of FPGAs and a novel 3D stacking method enabled by the application of nanomaterials, 3D nFPGA obtains a 4.5X footprint reduction compared to traditional CMOS-based 2D FPGAs. With a customized design automation flow, we evaluate the performance and power of 3D nFPGA driven by the 20 largest MCNC benchmarks. Results demonstrate that 3D nFPGA is able to provide a performance gain of 2.6X with a small power overhead comparing to the CMOS 2D FPGA architecture.
AB - In this paper, we introduce a novel reconfigurable architecture, named 3D nFPGA, which utilizes 3D integration techniques and new nanoscale materials synergistically. The proposed architecture is based on CMOS-nano hybrid techniques that incorporate nanomaterials such as carbon nanotube bundles and nanowire crossbars into CMOS fabrication process. Using unique features of FPGAs and a novel 3D stacking method enabled by the application of nanomaterials, 3D nFPGA obtains a 4.5X footprint reduction compared to traditional CMOS-based 2D FPGAs. With a customized design automation flow, we evaluate the performance and power of 3D nFPGA driven by the 20 largest MCNC benchmarks. Results demonstrate that 3D nFPGA is able to provide a performance gain of 2.6X with a small power overhead comparing to the CMOS 2D FPGA architecture.
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U2 - 10.1109/ICCAD.2007.4397357
DO - 10.1109/ICCAD.2007.4397357
M3 - Conference contribution
AN - SCOPUS:50349100130
SN - 1424413826
SN - 9781424413829
T3 - IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD
SP - 758
EP - 764
BT - 2007 IEEE/ACM International Conference on Computer-Aided Design, ICCAD
T2 - 2007 IEEE/ACM International Conference on Computer-Aided Design, ICCAD
Y2 - 4 November 2007 through 8 November 2007
ER -