Patterning methods for stretchable structures

Kevin L Lin (Inventor), Kanti Jain (Inventor)

Research output: Patent


Described herein are processing techniques for fabrication of stretchable and/or flexible electronic devices using laser ablation patterning methods. The laser ablation patterning methods utilized herein allow for efficient manufacture of large area (e.g., up to 1 mm2 or greater or 1 m2 or greater) stretchable and/or flexible electronic devices, for example manufacturing methods permitting a reduced number of steps. The techniques described herein further provide for improved heterogeneous integration of components within an electronic device, for example components having improved alignment and/or relative positioning within an electronic device. Also described herein are flexible and/or stretchable electronic devices, such as interconnects, sensors and actuators.
Original languageEnglish (US)
U.S. patent number8187795
Filing date12/9/08
StatePublished - May 29 2012

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