Pattern transfer printing by kinetic control of adhesion to an elastomeric stamp

Yugang Sun (Inventor), Matthew Meitl (Inventor), Dahl-Young Khang (Inventor), Etienne Menard (Inventor), Zhengtao Zhu (Inventor), Keon Jae Lee (Inventor), Ralph G Nuzzo (Inventor), John A Rogers (Inventor)

Research output: Patent

Abstract

The present invention provides methods, systems and system components for transferring, assembling and integrating features and arrays of features having selected nanosized and/or microsized physical dimensions, shapes and spatial orientations. Methods of the present invention utilize principles of ‘soft adhesion’ to guide the transfer, assembly and/or integration of features, such as printable semiconductor elements or other components of electronic devices. Methods of the present invention are useful for transferring features from a donor substrate to the transfer surface of an elastomeric transfer device and, optionally, from the transfer surface of an elastomeric transfer device to the receiving surface of a receiving substrate. The present methods and systems provide highly efficient, registered transfer of features and arrays of features, such as printable semiconductor element, in a concerted manner that maintains the relative spatial orientations of transferred features.
Original languageEnglish (US)
U.S. patent number7943491
StatePublished - May 17 2011

Fingerprint

Dive into the research topics of 'Pattern transfer printing by kinetic control of adhesion to an elastomeric stamp'. Together they form a unique fingerprint.

Cite this