TY - GEN
T1 - Partition and place finite element model on wafer-scale engine
AU - Liu, Jinwei
AU - Zhang, Xiaopeng
AU - Lin, Shiju
AU - Zang, Xinshi
AU - Chen, Jingsong
AU - Jiang, Bentian
AU - Wong, Martin D.F.
AU - Young, Evangeline F.Y.
N1 - Publisher Copyright:
© 2022 ACM.
PY - 2022/7/10
Y1 - 2022/7/10
N2 - The finite element method (FEM) is a well-known technique for approximately solving partial differential equations and it finds application in various engineering disciplines. The recently introduced wafer-scale engine (WSE) has shown the potential to accelerate FEM by up to 10,000×. However, accelerating FEM to the full potential of a WSE is non-trivial. Thus, in this work, we propose a partitioning algorithm to partition a 3D finite element model into tiles. The tiles can be thought of as a special netlist and are placed onto the 2D array of a WSE by our placement algorithm. Compared to the best-known approach, our partitioning has around 5% higher accuracy, and our placement algorithm can produce around 11% shorter wirelength (L1.5-normalized) on average.
AB - The finite element method (FEM) is a well-known technique for approximately solving partial differential equations and it finds application in various engineering disciplines. The recently introduced wafer-scale engine (WSE) has shown the potential to accelerate FEM by up to 10,000×. However, accelerating FEM to the full potential of a WSE is non-trivial. Thus, in this work, we propose a partitioning algorithm to partition a 3D finite element model into tiles. The tiles can be thought of as a special netlist and are placed onto the 2D array of a WSE by our placement algorithm. Compared to the best-known approach, our partitioning has around 5% higher accuracy, and our placement algorithm can produce around 11% shorter wirelength (L1.5-normalized) on average.
UR - http://www.scopus.com/inward/record.url?scp=85137501966&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85137501966&partnerID=8YFLogxK
U2 - 10.1145/3489517.3530565
DO - 10.1145/3489517.3530565
M3 - Conference contribution
AN - SCOPUS:85137501966
T3 - Proceedings - Design Automation Conference
SP - 631
EP - 636
BT - Proceedings of the 59th ACM/IEEE Design Automation Conference, DAC 2022
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 59th ACM/IEEE Design Automation Conference, DAC 2022
Y2 - 10 July 2022 through 14 July 2022
ER -