TY - JOUR
T1 - Parallel-kinematics XYZ MEMS part 2
T2 - Fabrication and experimental characterization
AU - Koo, Bonjin
AU - Correa, Jorge E.
AU - Ferreira, Placid M.
N1 - This work was supported in part by the National Science Foundation under grants CMMI-0749028 and 0800863 . Funds from the Tungchao Julia Lu Professorship in the Department of Mechanical Science and Engineering also made this work possible. The authors acknowledge the use of the Micro-Nano Mechanical Systems Laboratory and the Micro-Nano Technology Laboratory for the fabrication and characterization of the devices reported in this paper. Nick Toombs prepared the 3-D renderings of the device.
PY - 2016/10/1
Y1 - 2016/10/1
N2 - This paper, the second of a set of two papers addressing parallel-kinematics MEMS stages for spatial translation, deals with fabrication, characterization and control of such devices. Double device layer SOI (silicon-on-insulator) substrates are used, providing three layers (two device layers and the handle) into which the elements of the stage can be mapped. Using the mechanism concept, realization scheme, and kinematic and dynamic models developed in the first paper of this set, this paper provides a detailed approach to fabricating these devices. The stages fabricated have a workspace cube of roughly 20 μm on the side, an in-plane stiffness of 96 N/m, and an out-of-plane stiffness of 166 N/m. Further, it characterizes the performance of the individual actuating and sensing elements, configures feedback controllers for each actuated joint, and assesses and verifies the stage's designed performance. Finally, it demonstrates full 3-axis, closed-loop positioning of a MEMS stage.
AB - This paper, the second of a set of two papers addressing parallel-kinematics MEMS stages for spatial translation, deals with fabrication, characterization and control of such devices. Double device layer SOI (silicon-on-insulator) substrates are used, providing three layers (two device layers and the handle) into which the elements of the stage can be mapped. Using the mechanism concept, realization scheme, and kinematic and dynamic models developed in the first paper of this set, this paper provides a detailed approach to fabricating these devices. The stages fabricated have a workspace cube of roughly 20 μm on the side, an in-plane stiffness of 96 N/m, and an out-of-plane stiffness of 166 N/m. Further, it characterizes the performance of the individual actuating and sensing elements, configures feedback controllers for each actuated joint, and assesses and verifies the stage's designed performance. Finally, it demonstrates full 3-axis, closed-loop positioning of a MEMS stage.
KW - Nanopositioning
KW - Parallel-kinematics mechanisms
KW - XYZ MEMS
UR - https://www.scopus.com/pages/publications/84992623552
UR - https://www.scopus.com/pages/publications/84992623552#tab=citedBy
U2 - 10.1016/j.precisioneng.2016.04.008
DO - 10.1016/j.precisioneng.2016.04.008
M3 - Article
AN - SCOPUS:84992623552
SN - 0141-6359
VL - 46
SP - 147
EP - 157
JO - Precision Engineering
JF - Precision Engineering
ER -