TY - GEN
T1 - Parallel-in-Space-Time Analysis of Electromagnetic Interference in Electronic Enclosures
AU - Wang, Shu
AU - Peng, Zhen
N1 - Publisher Copyright:
© 2018 IEEE.
PY - 2018/11/13
Y1 - 2018/11/13
N2 - There has been a growing and pressing need to rapidly evaluate the electromagnetic (EM) interference and susceptibility of electronic devices inside complex enclosures. To address this need, this paper leverages the time-domain wave physics to develop first-principles computational and predictive models. The temporal multi-scale challenge in analyzing longtime cavity transient dynamics is addressed by a new time-evolution Green's function and a space-time domain decomposition method. The research overcomes the time-step limitation and the sequential-in-time barrier, and achieves first-time a parallel-in-time capability for solving transient cavity problems. The results are valuable for the broadband analysis of EM emission and interference, shielding effectiveness and integrity, and integrated design of electronics and enclosures.
AB - There has been a growing and pressing need to rapidly evaluate the electromagnetic (EM) interference and susceptibility of electronic devices inside complex enclosures. To address this need, this paper leverages the time-domain wave physics to develop first-principles computational and predictive models. The temporal multi-scale challenge in analyzing longtime cavity transient dynamics is addressed by a new time-evolution Green's function and a space-time domain decomposition method. The research overcomes the time-step limitation and the sequential-in-time barrier, and achieves first-time a parallel-in-time capability for solving transient cavity problems. The results are valuable for the broadband analysis of EM emission and interference, shielding effectiveness and integrity, and integrated design of electronics and enclosures.
KW - Domain decomposition
KW - Electromagnetic interference
KW - Electronic enclosure
KW - Green's function
KW - Time domain
UR - http://www.scopus.com/inward/record.url?scp=85059032000&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85059032000&partnerID=8YFLogxK
U2 - 10.1109/EPEPS.2018.8534227
DO - 10.1109/EPEPS.2018.8534227
M3 - Conference contribution
AN - SCOPUS:85059032000
T3 - EPEPS 2018 - IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems
SP - 181
EP - 183
BT - EPEPS 2018 - IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 27th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2018
Y2 - 14 October 2018 through 17 October 2018
ER -