Packaging modeling using fast broadband surface integral equation method

Zhi Guo Qian; Weng Cho Chew

doi:10.1109/EPEP.2008.4675952

Packaging modeling using fast broadband surface integral equation method

Zhi Guo Qian, Weng Cho Chew

Electrical and Computer Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

The augmented electric field integral equation with frequency scaling provides a stable formulation over broad frequency band. With the iterative solver and the mixed-form fast multipole algorithm, large scale packaging problems can be solved efficiently.

Original language	English (US)
Title of host publication	Electrical Performance of Electronic Packaging, EPEP 2008
Pages	347-350
Number of pages	4
DOIs	https://doi.org/10.1109/EPEP.2008.4675952
State	Published - Dec 31 2008
Event	17th Conference on Electrical Performance of Electronic Packaging, EPEP 2008 - San Jose, CA, United States Duration: Oct 27 2008 → Oct 29 2008

Publication series

Name	Electrical Performance of Electronic Packaging, EPEP

Other

Other	17th Conference on Electrical Performance of Electronic Packaging, EPEP 2008
Country	United States
City	San Jose, CA
Period	10/27/08 → 10/29/08

ASJC Scopus subject areas

Electrical and Electronic Engineering

Access to Document

10.1109/EPEP.2008.4675952

Fingerprint Dive into the research topics of 'Packaging modeling using fast broadband surface integral equation method'. Together they form a unique fingerprint.

Cite this

Qian, ZG & Chew, WC 2008, Packaging modeling using fast broadband surface integral equation method. in Electrical Performance of Electronic Packaging, EPEP 2008., 4675952, Electrical Performance of Electronic Packaging, EPEP, pp. 347-350, 17th Conference on Electrical Performance of Electronic Packaging, EPEP 2008, San Jose, CA, United States, 10/27/08. https://doi.org/10.1109/EPEP.2008.4675952

@inproceedings{129544f083324522919cf2e1e1b8311b,

title = "Packaging modeling using fast broadband surface integral equation method",

abstract = "The augmented electric field integral equation with frequency scaling provides a stable formulation over broad frequency band. With the iterative solver and the mixed-form fast multipole algorithm, large scale packaging problems can be solved efficiently.",

author = "Qian, {Zhi Guo} and Chew, {Weng Cho}",

year = "2008",

month = dec,

day = "31",

doi = "10.1109/EPEP.2008.4675952",

language = "English (US)",

isbn = "9781424428731",

series = "Electrical Performance of Electronic Packaging, EPEP",

pages = "347--350",

booktitle = "Electrical Performance of Electronic Packaging, EPEP 2008",

note = "17th Conference on Electrical Performance of Electronic Packaging, EPEP 2008 ; Conference date: 27-10-2008 Through 29-10-2008",

}

TY - GEN

T1 - Packaging modeling using fast broadband surface integral equation method

AU - Qian, Zhi Guo

AU - Chew, Weng Cho

PY - 2008/12/31

Y1 - 2008/12/31

N2 - The augmented electric field integral equation with frequency scaling provides a stable formulation over broad frequency band. With the iterative solver and the mixed-form fast multipole algorithm, large scale packaging problems can be solved efficiently.

AB - The augmented electric field integral equation with frequency scaling provides a stable formulation over broad frequency band. With the iterative solver and the mixed-form fast multipole algorithm, large scale packaging problems can be solved efficiently.

UR - http://www.scopus.com/inward/record.url?scp=58049108880&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=58049108880&partnerID=8YFLogxK

U2 - 10.1109/EPEP.2008.4675952

DO - 10.1109/EPEP.2008.4675952

M3 - Conference contribution

AN - SCOPUS:58049108880

SN - 9781424428731

T3 - Electrical Performance of Electronic Packaging, EPEP

SP - 347

EP - 350

BT - Electrical Performance of Electronic Packaging, EPEP 2008

T2 - 17th Conference on Electrical Performance of Electronic Packaging, EPEP 2008

Y2 - 27 October 2008 through 29 October 2008

ER -