Packaging modeling using fast broadband surface integral equation method

Zhi Guo Qian, Weng Cho Chew

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The augmented electric field integral equation with frequency scaling provides a stable formulation over broad frequency band. With the iterative solver and the mixed-form fast multipole algorithm, large scale packaging problems can be solved efficiently.

Original languageEnglish (US)
Title of host publicationElectrical Performance of Electronic Packaging, EPEP 2008
Pages347-350
Number of pages4
DOIs
StatePublished - Dec 31 2008
Event17th Conference on Electrical Performance of Electronic Packaging, EPEP 2008 - San Jose, CA, United States
Duration: Oct 27 2008Oct 29 2008

Publication series

NameElectrical Performance of Electronic Packaging, EPEP

Other

Other17th Conference on Electrical Performance of Electronic Packaging, EPEP 2008
CountryUnited States
CitySan Jose, CA
Period10/27/0810/29/08

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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  • Cite this

    Qian, Z. G., & Chew, W. C. (2008). Packaging modeling using fast broadband surface integral equation method. In Electrical Performance of Electronic Packaging, EPEP 2008 (pp. 347-350). [4675952] (Electrical Performance of Electronic Packaging, EPEP). https://doi.org/10.1109/EPEP.2008.4675952