@inproceedings{129544f083324522919cf2e1e1b8311b,
title = "Packaging modeling using fast broadband surface integral equation method",
abstract = "The augmented electric field integral equation with frequency scaling provides a stable formulation over broad frequency band. With the iterative solver and the mixed-form fast multipole algorithm, large scale packaging problems can be solved efficiently.",
author = "Qian, {Zhi Guo} and Chew, {Weng Cho}",
year = "2008",
month = dec,
day = "31",
doi = "10.1109/EPEP.2008.4675952",
language = "English (US)",
isbn = "9781424428731",
series = "Electrical Performance of Electronic Packaging, EPEP",
pages = "347--350",
booktitle = "Electrical Performance of Electronic Packaging, EPEP 2008",
note = "17th Conference on Electrical Performance of Electronic Packaging, EPEP 2008 ; Conference date: 27-10-2008 Through 29-10-2008",
}