TY - GEN
T1 - Packaging education for the 21st century
AU - Schutt-Aine, J.
AU - Cangellaris, A.
AU - Michielssen, E.
N1 - Publisher Copyright:
© 1998 IEEE.
PY - 1998
Y1 - 1998
N2 - Packaging and signal integrity has become a critical area in the design of high-speed communications systems and fast computers. Many research areas have emerged from industry and universities to address issues related to packaging. However, the educational infrastructure is seriously lagging. At the University of Illinois, (UIUC), an Internet-based virtual classroom is being explored for packaging education. The effort makes used of the existing infrastructure to implement a modern platform for asynchronous learning.
AB - Packaging and signal integrity has become a critical area in the design of high-speed communications systems and fast computers. Many research areas have emerged from industry and universities to address issues related to packaging. However, the educational infrastructure is seriously lagging. At the University of Illinois, (UIUC), an Internet-based virtual classroom is being explored for packaging education. The effort makes used of the existing infrastructure to implement a modern platform for asynchronous learning.
UR - http://www.scopus.com/inward/record.url?scp=0031642749&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=0031642749&partnerID=8YFLogxK
U2 - 10.1109/ECTC.1998.678747
DO - 10.1109/ECTC.1998.678747
M3 - Conference contribution
AN - SCOPUS:0031642749
SN - 0780345266
T3 - Proceedings - Electronic Components and Technology Conference
SP - 544
EP - 546
BT - 1998 Proceedings - 48th Electronic Components and Technology Conference, ECTC 1998
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 48th Electronic Components and Technology Conference, ECTC 1998
Y2 - 25 May 1998 through 28 May 1998
ER -