Abstract
Packaging and signal integrity has become a critical area in the design of high-speed communications systems and fast computers. Many research areas have emerged from industry and universities to address issues related to packaging. However, the educational infrastructure is seriously lagging. At the University of Illinois, (UIUC), an Internet-based virtual classroom is being explored for packaging education. The effort makes used of the existing infrastructure to implement a modern platform for asynchronous learning.
| Original language | English (US) |
|---|---|
| Title of host publication | 1998 Proceedings - 48th Electronic Components and Technology Conference, ECTC 1998 |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| Pages | 544-546 |
| Number of pages | 3 |
| ISBN (Print) | 0780345266 |
| DOIs | |
| State | Published - Jan 1 1998 |
| Event | 48th Electronic Components and Technology Conference, ECTC 1998 - Seattle, United States Duration: May 25 1998 → May 28 1998 |
Publication series
| Name | Proceedings - Electronic Components and Technology Conference |
|---|---|
| Volume | Part F133492 |
| ISSN (Print) | 0569-5503 |
Other
| Other | 48th Electronic Components and Technology Conference, ECTC 1998 |
|---|---|
| Country | United States |
| City | Seattle |
| Period | 5/25/98 → 5/28/98 |
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering
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Cite this
Schutt-Aine, J., Cangellaris, A., & Michielssen, E. (1998). Packaging education for the 21st century. In 1998 Proceedings - 48th Electronic Components and Technology Conference, ECTC 1998 (pp. 544-546). [678747] (Proceedings - Electronic Components and Technology Conference; Vol. Part F133492). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ECTC.1998.678747