@inproceedings{afa255ef093d4047ac202f4df031920b,
title = "Packaging education for the 21st century",
abstract = "Packaging and signal integrity has become a critical area in the design of high-speed communications systems and fast computers. Many research areas have emerged from industry and universities to address issues related to packaging. However, the educational infrastructure is seriously lagging. At the University of Illinois, (UIUC), an Internet-based virtual classroom is being explored for packaging education. The effort makes used of the existing infrastructure to implement a modern platform for asynchronous learning.",
author = "J. Schutt-Aine and A. Cangellaris and E. Michielssen",
year = "1998",
month = jan,
day = "1",
doi = "10.1109/ECTC.1998.678747",
language = "English (US)",
isbn = "0780345266",
series = "Proceedings - Electronic Components and Technology Conference",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "544--546",
booktitle = "1998 Proceedings - 48th Electronic Components and Technology Conference, ECTC 1998",
address = "United States",
note = "48th Electronic Components and Technology Conference, ECTC 1998 ; Conference date: 25-05-1998 Through 28-05-1998",
}