Packaging education for the 21st century

Research output: Chapter in Book/Report/Conference proceedingConference contribution


Packaging and signal integrity has become a critical area in the design of high-speed communications systems and fast computers. Many research areas have emerged from industry and universities to address issues related to packaging. However, the educational infrastructure is seriously lagging. At the University of Illinois, (UIUC), an Internet-based virtual classroom is being explored for packaging education. The effort makes used of the existing infrastructure to implement a modern platform for asynchronous learning.

Original languageEnglish (US)
Title of host publication1998 Proceedings - 48th Electronic Components and Technology Conference, ECTC 1998
PublisherInstitute of Electrical and Electronics Engineers Inc.
Number of pages3
ISBN (Print)0780345266
StatePublished - 1998
Event48th Electronic Components and Technology Conference, ECTC 1998 - Seattle, United States
Duration: May 25 1998May 28 1998

Publication series

NameProceedings - Electronic Components and Technology Conference
VolumePart F133492
ISSN (Print)0569-5503


Other48th Electronic Components and Technology Conference, ECTC 1998
Country/TerritoryUnited States

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering


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