Packaging and thin-film truncation effects on thin-film open end microstrip line for miniature multilayer MMICs

Ao Sheng Rong, Vijai K. Tripathi, Zhong Liang Sun

Research output: Contribution to conferencePaper

Abstract

This paper analyzes the packaging and thin-film truncation effects of the open end of thin-film microstrip lines for miniature multilayer MMICs. The formulation is implemented by the 3-D finite difference method in conjunction with the higher order asymptotic boundary condition. Special treatment of mesh nodes at the corner and the fringes of the boundary is given by the interpolation. The results presented here show that (1) the field distribution is highly disturbed by the truncation of the thin dielectric film; (2) the electrical performance varies as the thin dielectric film is truncated near the open end; and (3) when a shield metal box, if any, is less than twice the thickness of the substrate, the packaging effect becomes significant.

Original languageEnglish (US)
Pages113-114
Number of pages2
StatePublished - Dec 1 1994
Externally publishedYes
EventProceedings of the 3rd Topical Meeting on Electrical Performance of Electronic Packaging - Monterey, CA, USA
Duration: Nov 2 1994Nov 4 1994

Other

OtherProceedings of the 3rd Topical Meeting on Electrical Performance of Electronic Packaging
CityMonterey, CA, USA
Period11/2/9411/4/94

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ASJC Scopus subject areas

  • Engineering(all)

Cite this

Rong, A. S., Tripathi, V. K., & Sun, Z. L. (1994). Packaging and thin-film truncation effects on thin-film open end microstrip line for miniature multilayer MMICs. 113-114. Paper presented at Proceedings of the 3rd Topical Meeting on Electrical Performance of Electronic Packaging, Monterey, CA, USA, .