Oscillatory crack growth in glass

B. D. Ferney; M. R. Devary; K. J. Hsia; A. Needleman

doi:10.1016/S1359-6462(99)00161-X

Oscillatory crack growth in glass

B. D. Ferney, M. R. Devary, K. J. Hsia, A. Needleman

University of Illinois Urbana-Champaign

Research output: Contribution to journal › Article › peer-review

Abstract

By slowly lowering a glass plate through a heater and into cold water, a crack is formed whose tip stays ahead of the water line and whose path depends upon the dipping velocity and the temperature difference between the heater and the water. Crack morphology changes from straight to oscillatory to branching as the temperature difference is increased. Calculations of thermal stress induced crack growth for a single crack exhibit both oscillatory and crack branching. Due to unrealistically high dipping speeds in the calculations, branching tends to be favored more than in the experiments. Nevertheless, computations successfully reproduce many features of the crack behavior.

Original language	English (US)
Pages (from-to)	275-281
Number of pages	7
Journal	Scripta Materialia
Volume	41
Issue number	3
DOIs	https://doi.org/10.1016/S1359-6462(99)00161-X
State	Published - Jul 9 1999

ASJC Scopus subject areas

General Materials Science
Condensed Matter Physics
Mechanics of Materials
Mechanical Engineering
Metals and Alloys

Online availability

10.1016/S1359-6462(99)00161-X

Library availability

Discover UIUC Full Text

Cite this

@article{0b58126485394deab155481b9430d81c,

title = "Oscillatory crack growth in glass",

abstract = "By slowly lowering a glass plate through a heater and into cold water, a crack is formed whose tip stays ahead of the water line and whose path depends upon the dipping velocity and the temperature difference between the heater and the water. Crack morphology changes from straight to oscillatory to branching as the temperature difference is increased. Calculations of thermal stress induced crack growth for a single crack exhibit both oscillatory and crack branching. Due to unrealistically high dipping speeds in the calculations, branching tends to be favored more than in the experiments. Nevertheless, computations successfully reproduce many features of the crack behavior.",

author = "Ferney, {B. D.} and Devary, {M. R.} and Hsia, {K. J.} and A. Needleman",

note = "Funding Information: This work has been supported by the National Science Foundation through grant No. CMS 95-22661. A.N. is grateful for support from Sandia Corporation through grant LG-3057. We are also grateful to the help provided by Prof. J.W. Phillips in photographing the experimental specimens. ",

year = "1999",

month = jul,

day = "9",

doi = "10.1016/S1359-6462(99)00161-X",

language = "English (US)",

volume = "41",

pages = "275--281",

journal = "Scripta Materialia",

issn = "1359-6462",

publisher = "Elsevier Limited",

number = "3",

}

TY - JOUR

T1 - Oscillatory crack growth in glass

AU - Ferney, B. D.

AU - Devary, M. R.

AU - Hsia, K. J.

AU - Needleman, A.

N1 - Funding Information: This work has been supported by the National Science Foundation through grant No. CMS 95-22661. A.N. is grateful for support from Sandia Corporation through grant LG-3057. We are also grateful to the help provided by Prof. J.W. Phillips in photographing the experimental specimens.

PY - 1999/7/9

Y1 - 1999/7/9

N2 - By slowly lowering a glass plate through a heater and into cold water, a crack is formed whose tip stays ahead of the water line and whose path depends upon the dipping velocity and the temperature difference between the heater and the water. Crack morphology changes from straight to oscillatory to branching as the temperature difference is increased. Calculations of thermal stress induced crack growth for a single crack exhibit both oscillatory and crack branching. Due to unrealistically high dipping speeds in the calculations, branching tends to be favored more than in the experiments. Nevertheless, computations successfully reproduce many features of the crack behavior.

AB - By slowly lowering a glass plate through a heater and into cold water, a crack is formed whose tip stays ahead of the water line and whose path depends upon the dipping velocity and the temperature difference between the heater and the water. Crack morphology changes from straight to oscillatory to branching as the temperature difference is increased. Calculations of thermal stress induced crack growth for a single crack exhibit both oscillatory and crack branching. Due to unrealistically high dipping speeds in the calculations, branching tends to be favored more than in the experiments. Nevertheless, computations successfully reproduce many features of the crack behavior.

UR - http://www.scopus.com/inward/record.url?scp=0032654005&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0032654005&partnerID=8YFLogxK

U2 - 10.1016/S1359-6462(99)00161-X

DO - 10.1016/S1359-6462(99)00161-X

M3 - Article

AN - SCOPUS:0032654005

SN - 1359-6462

VL - 41

SP - 275

EP - 281

JO - Scripta Materialia

JF - Scripta Materialia

IS - 3

ER -

Oscillatory crack growth in glass

Abstract

ASJC Scopus subject areas

Online availability

Library availability

Related links

Fingerprint

Cite this