Orientation relationships among Sn/Cu6Sn5/Cu 3Sn/(111)Cu in the eutectic SnBi/(111)Cu solder joint

Pan Ju Shang; Zhi Quan Liu; Douxing Li; Jian Ku Shang

doi:10.1109/ICEPT.2010.5582454

Orientation relationships among Sn/Cu₆Sn₅/Cu ₃Sn/(111)Cu in the eutectic SnBi/(111)Cu solder joint

Pan Ju Shang, Zhi Quan Liu, Douxing Li, Jian Ku Shang

Materials Science and Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

TEM (transmission electron microscope) observations and precise SAED (selected area electron diffraction) analysis were used to character the growth of IMCs (intermetallic compounds) between eutectic SnBi solder and Cu(111) substrate after reflowing. The results indicated that after reflowing the interface between eutectic SnBi solder and Cu(111) substrate is made up by four groups of neighboring phases: Cu(111)/Cu₆Sn₅, Cu(111)/Cu₃Sn, Cu₃Sn/Cu₆Sn₅, Cu ₆Sn₅/Sn. The precise SAED analysis revealed during nucleation and growth process of interfacial IMCs the neighboring phases kept perfect orientation relationships in order to decrease the nucleation driving force of IMCs.

Original language	English (US)
Title of host publication	Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010
Pages	165-169
Number of pages	5
DOIs	https://doi.org/10.1109/ICEPT.2010.5582454
State	Published - Nov 24 2010
Event	2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010 - Xi'an, China Duration: Aug 16 2010 → Aug 19 2010

Publication series

Name	Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010

Other

Other	2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010
Country	China
City	Xi'an
Period	8/16/10 → 8/19/10

ASJC Scopus subject areas

Electrical and Electronic Engineering

Access to Document

10.1109/ICEPT.2010.5582454

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Shang, P. J., Liu, Z. Q., Li, D., & Shang, J. K. (2010). Orientation relationships among Sn/Cu₆Sn₅/Cu ₃Sn/(111)Cu in the eutectic SnBi/(111)Cu solder joint. In Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010 (pp. 165-169). [5582454] (Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010). https://doi.org/10.1109/ICEPT.2010.5582454

Orientation relationships among Sn/Cu₆Sn₅/Cu ₃Sn/(111)Cu in the eutectic SnBi/(111)Cu solder joint. / Shang, Pan Ju; Liu, Zhi Quan; Li, Douxing; Shang, Jian Ku.

Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010. 2010. p. 165-169 5582454 (Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Shang, PJ, Liu, ZQ, Li, D & Shang, JK 2010, Orientation relationships among Sn/Cu₆Sn₅/Cu ₃Sn/(111)Cu in the eutectic SnBi/(111)Cu solder joint. in Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010., 5582454, Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010, pp. 165-169, 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010, Xi'an, China, 8/16/10. https://doi.org/10.1109/ICEPT.2010.5582454

Shang PJ, Liu ZQ, Li D, Shang JK. Orientation relationships among Sn/Cu₆Sn₅/Cu ₃Sn/(111)Cu in the eutectic SnBi/(111)Cu solder joint. In Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010. 2010. p. 165-169. 5582454. (Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010). https://doi.org/10.1109/ICEPT.2010.5582454

Shang, Pan Ju ; Liu, Zhi Quan ; Li, Douxing ; Shang, Jian Ku. / Orientation relationships among Sn/Cu₆Sn₅/Cu ₃Sn/(111)Cu in the eutectic SnBi/(111)Cu solder joint. Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010. 2010. pp. 165-169 (Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010).

@inproceedings{6bad7d4ccd9f41d68533a6897de855a6,

title = "Orientation relationships among Sn/Cu6Sn5/Cu 3Sn/(111)Cu in the eutectic SnBi/(111)Cu solder joint",

abstract = "TEM (transmission electron microscope) observations and precise SAED (selected area electron diffraction) analysis were used to character the growth of IMCs (intermetallic compounds) between eutectic SnBi solder and Cu(111) substrate after reflowing. The results indicated that after reflowing the interface between eutectic SnBi solder and Cu(111) substrate is made up by four groups of neighboring phases: Cu(111)/Cu6Sn5, Cu(111)/Cu3Sn, Cu3Sn/Cu6Sn5, Cu 6Sn5/Sn. The precise SAED analysis revealed during nucleation and growth process of interfacial IMCs the neighboring phases kept perfect orientation relationships in order to decrease the nucleation driving force of IMCs.",

author = "Shang, {Pan Ju} and Liu, {Zhi Quan} and Douxing Li and Shang, {Jian Ku}",

year = "2010",

month = nov,

day = "24",

doi = "10.1109/ICEPT.2010.5582454",

language = "English (US)",

isbn = "9781424481422",

series = "Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010",

pages = "165--169",

booktitle = "Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010",

note = "2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010 ; Conference date: 16-08-2010 Through 19-08-2010",

}

TY - GEN

T1 - Orientation relationships among Sn/Cu6Sn5/Cu 3Sn/(111)Cu in the eutectic SnBi/(111)Cu solder joint

AU - Shang, Pan Ju

AU - Liu, Zhi Quan

AU - Li, Douxing

AU - Shang, Jian Ku

PY - 2010/11/24

Y1 - 2010/11/24

N2 - TEM (transmission electron microscope) observations and precise SAED (selected area electron diffraction) analysis were used to character the growth of IMCs (intermetallic compounds) between eutectic SnBi solder and Cu(111) substrate after reflowing. The results indicated that after reflowing the interface between eutectic SnBi solder and Cu(111) substrate is made up by four groups of neighboring phases: Cu(111)/Cu6Sn5, Cu(111)/Cu3Sn, Cu3Sn/Cu6Sn5, Cu 6Sn5/Sn. The precise SAED analysis revealed during nucleation and growth process of interfacial IMCs the neighboring phases kept perfect orientation relationships in order to decrease the nucleation driving force of IMCs.

AB - TEM (transmission electron microscope) observations and precise SAED (selected area electron diffraction) analysis were used to character the growth of IMCs (intermetallic compounds) between eutectic SnBi solder and Cu(111) substrate after reflowing. The results indicated that after reflowing the interface between eutectic SnBi solder and Cu(111) substrate is made up by four groups of neighboring phases: Cu(111)/Cu6Sn5, Cu(111)/Cu3Sn, Cu3Sn/Cu6Sn5, Cu 6Sn5/Sn. The precise SAED analysis revealed during nucleation and growth process of interfacial IMCs the neighboring phases kept perfect orientation relationships in order to decrease the nucleation driving force of IMCs.

UR - http://www.scopus.com/inward/record.url?scp=78449268679&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=78449268679&partnerID=8YFLogxK

U2 - 10.1109/ICEPT.2010.5582454

DO - 10.1109/ICEPT.2010.5582454

M3 - Conference contribution

AN - SCOPUS:78449268679

SN - 9781424481422

T3 - Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010

SP - 165

EP - 169

BT - Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010

T2 - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010

Y2 - 16 August 2010 through 19 August 2010

ER -