Orientation relationships among Sn/Cu6Sn5/Cu 3Sn/(111)Cu in the eutectic SnBi/(111)Cu solder joint

Pan Ju Shang, Zhi Quan Liu, Douxing Li, Jian Ku Shang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

TEM (transmission electron microscope) observations and precise SAED (selected area electron diffraction) analysis were used to character the growth of IMCs (intermetallic compounds) between eutectic SnBi solder and Cu(111) substrate after reflowing. The results indicated that after reflowing the interface between eutectic SnBi solder and Cu(111) substrate is made up by four groups of neighboring phases: Cu(111)/Cu6Sn5, Cu(111)/Cu3Sn, Cu3Sn/Cu6Sn5, Cu 6Sn5/Sn. The precise SAED analysis revealed during nucleation and growth process of interfacial IMCs the neighboring phases kept perfect orientation relationships in order to decrease the nucleation driving force of IMCs.

Original languageEnglish (US)
Title of host publicationProceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010
Pages165-169
Number of pages5
DOIs
StatePublished - Nov 24 2010
Event2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010 - Xi'an, China
Duration: Aug 16 2010Aug 19 2010

Publication series

NameProceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010

Other

Other2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010
CountryChina
CityXi'an
Period8/16/108/19/10

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Fingerprint Dive into the research topics of 'Orientation relationships among Sn/Cu<sub>6</sub>Sn<sub>5</sub>/Cu <sub>3</sub>Sn/(111)Cu in the eutectic SnBi/(111)Cu solder joint'. Together they form a unique fingerprint.

Cite this