TY - GEN
T1 - Orientation relationships among Sn/Cu6Sn5/Cu 3Sn/(111)Cu in the eutectic SnBi/(111)Cu solder joint
AU - Shang, Pan Ju
AU - Liu, Zhi Quan
AU - Li, Douxing
AU - Shang, Jian Ku
PY - 2010/11/24
Y1 - 2010/11/24
N2 - TEM (transmission electron microscope) observations and precise SAED (selected area electron diffraction) analysis were used to character the growth of IMCs (intermetallic compounds) between eutectic SnBi solder and Cu(111) substrate after reflowing. The results indicated that after reflowing the interface between eutectic SnBi solder and Cu(111) substrate is made up by four groups of neighboring phases: Cu(111)/Cu6Sn5, Cu(111)/Cu3Sn, Cu3Sn/Cu6Sn5, Cu 6Sn5/Sn. The precise SAED analysis revealed during nucleation and growth process of interfacial IMCs the neighboring phases kept perfect orientation relationships in order to decrease the nucleation driving force of IMCs.
AB - TEM (transmission electron microscope) observations and precise SAED (selected area electron diffraction) analysis were used to character the growth of IMCs (intermetallic compounds) between eutectic SnBi solder and Cu(111) substrate after reflowing. The results indicated that after reflowing the interface between eutectic SnBi solder and Cu(111) substrate is made up by four groups of neighboring phases: Cu(111)/Cu6Sn5, Cu(111)/Cu3Sn, Cu3Sn/Cu6Sn5, Cu 6Sn5/Sn. The precise SAED analysis revealed during nucleation and growth process of interfacial IMCs the neighboring phases kept perfect orientation relationships in order to decrease the nucleation driving force of IMCs.
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U2 - 10.1109/ICEPT.2010.5582454
DO - 10.1109/ICEPT.2010.5582454
M3 - Conference contribution
AN - SCOPUS:78449268679
SN - 9781424481422
T3 - Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010
SP - 165
EP - 169
BT - Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010
T2 - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010
Y2 - 16 August 2010 through 19 August 2010
ER -