Abstract
Analytical and numerical formulations and simulations are presented in order to conduct sensitivity studies of physical parameters affecting thermal stress controlofviscoelastic structures during cure through designer materials tailored to alleviate or outright eliminate undesirable thermal stress states. Numerical simulations in terms of critical parameters are carried out to evaluate system responses.
Original language | English (US) |
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Pages (from-to) | 547-557 |
Number of pages | 11 |
Journal | Journal of Thermal Stresses |
Volume | 26 |
Issue number | 6 |
DOIs | |
State | Published - Jun 2003 |
Keywords
- Curing Processes
- Designer Materials
- Probability Of Failure
- Thermal Stresses
- Viscoelasticity
ASJC Scopus subject areas
- Materials Science(all)
- Condensed Matter Physics