Optimization of Liquid Cooling MicroChannel in 3D IC using Complete Converging and Diverging Channel Models

Leslie K. Hwang, Beomjin Kwon, Martin D.F. Wong

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In spite of the various aspects of thermal-aware designs in 3D IC, the thermal barrier is yet to overcome to enable the technology. As liquid cooling microchannel is highly effective means in thermal management, it has been rising as a promising technique to integrate into 3D IC. To attain the feasibility, it is crucial to design low-power and highly-efficient microchannel in compact chip packaging. In this work, we derive complete closed-form correlations which accurately model converging, diverging and uniform microchannels. We use microchannel designs of width 10-600 μm, tapering angle of -11-20° with Reynolds number of 39-99, inlet volumetric flow rate of 10- 8 m3/s and heat flux of 100 W/cm2 for the derivation. Then, we optimize the microchannel design to maximize the thermal performance while constraining pumping power and channel widths. Optimization is based on our derived correlations for heat transfer and pressure drop and the resulting microchannel designs are validated with numerical simulations. Temperature maps of the optimized channels from numerical simulation demonstrate accurate estimation of overall thermal resistance and proves the reliability of the optimization.

Original languageEnglish (US)
Title of host publicationProceedings of the 18th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2019
PublisherIEEE Computer Society
Pages1197-1203
Number of pages7
ISBN (Electronic)9781728124612
DOIs
StatePublished - May 2019
Event18th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2019 - Las Vegas, United States
Duration: May 28 2019May 31 2019

Publication series

NameInterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM
Volume2019-May
ISSN (Print)1936-3958

Conference

Conference18th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2019
CountryUnited States
CityLas Vegas
Period5/28/195/31/19

Fingerprint

Microchannels
Cooling
Liquids
Computer simulation
Heat resistance
Pressure drop
Heat flux
Packaging
Reynolds number
Flow rate
Heat transfer
Hot Temperature
Temperature

Keywords

  • 3D IC
  • Complete channel model
  • Converging channel
  • Diverging channel
  • MicroChannel optimization

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Electrical and Electronic Engineering

Cite this

Hwang, L. K., Kwon, B., & Wong, M. D. F. (2019). Optimization of Liquid Cooling MicroChannel in 3D IC using Complete Converging and Diverging Channel Models. In Proceedings of the 18th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2019 (pp. 1197-1203). [8757254] (InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM; Vol. 2019-May). IEEE Computer Society. https://doi.org/10.1109/ITHERM.2019.8757254

Optimization of Liquid Cooling MicroChannel in 3D IC using Complete Converging and Diverging Channel Models. / Hwang, Leslie K.; Kwon, Beomjin; Wong, Martin D.F.

Proceedings of the 18th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2019. IEEE Computer Society, 2019. p. 1197-1203 8757254 (InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM; Vol. 2019-May).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Hwang, LK, Kwon, B & Wong, MDF 2019, Optimization of Liquid Cooling MicroChannel in 3D IC using Complete Converging and Diverging Channel Models. in Proceedings of the 18th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2019., 8757254, InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM, vol. 2019-May, IEEE Computer Society, pp. 1197-1203, 18th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2019, Las Vegas, United States, 5/28/19. https://doi.org/10.1109/ITHERM.2019.8757254
Hwang LK, Kwon B, Wong MDF. Optimization of Liquid Cooling MicroChannel in 3D IC using Complete Converging and Diverging Channel Models. In Proceedings of the 18th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2019. IEEE Computer Society. 2019. p. 1197-1203. 8757254. (InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM). https://doi.org/10.1109/ITHERM.2019.8757254
Hwang, Leslie K. ; Kwon, Beomjin ; Wong, Martin D.F. / Optimization of Liquid Cooling MicroChannel in 3D IC using Complete Converging and Diverging Channel Models. Proceedings of the 18th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2019. IEEE Computer Society, 2019. pp. 1197-1203 (InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM).
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