TY - GEN
T1 - Optimization of Liquid Cooling MicroChannel in 3D IC using Complete Converging and Diverging Channel Models
AU - Hwang, Leslie K.
AU - Kwon, Beomjin
AU - Wong, Martin D.F.
N1 - Publisher Copyright:
© 2019 IEEE
PY - 2019/5
Y1 - 2019/5
N2 - In spite of the various aspects of thermal-aware designs in 3D IC, the thermal barrier is yet to overcome to enable the technology. As liquid cooling microchannel is highly effective means in thermal management, it has been rising as a promising technique to integrate into 3D IC. To attain the feasibility, it is crucial to design low-power and highly-efficient microchannel in compact chip packaging. In this work, we derive complete closed-form correlations which accurately model converging, diverging and uniform microchannels. We use microchannel designs of width 10-600 μm, tapering angle of -11-20° with Reynolds number of 39-99, inlet volumetric flow rate of 10- 8 m3/s and heat flux of 100 W/cm2 for the derivation. Then, we optimize the microchannel design to maximize the thermal performance while constraining pumping power and channel widths. Optimization is based on our derived correlations for heat transfer and pressure drop and the resulting microchannel designs are validated with numerical simulations. Temperature maps of the optimized channels from numerical simulation demonstrate accurate estimation of overall thermal resistance and proves the reliability of the optimization.
AB - In spite of the various aspects of thermal-aware designs in 3D IC, the thermal barrier is yet to overcome to enable the technology. As liquid cooling microchannel is highly effective means in thermal management, it has been rising as a promising technique to integrate into 3D IC. To attain the feasibility, it is crucial to design low-power and highly-efficient microchannel in compact chip packaging. In this work, we derive complete closed-form correlations which accurately model converging, diverging and uniform microchannels. We use microchannel designs of width 10-600 μm, tapering angle of -11-20° with Reynolds number of 39-99, inlet volumetric flow rate of 10- 8 m3/s and heat flux of 100 W/cm2 for the derivation. Then, we optimize the microchannel design to maximize the thermal performance while constraining pumping power and channel widths. Optimization is based on our derived correlations for heat transfer and pressure drop and the resulting microchannel designs are validated with numerical simulations. Temperature maps of the optimized channels from numerical simulation demonstrate accurate estimation of overall thermal resistance and proves the reliability of the optimization.
KW - 3D IC
KW - Complete channel model
KW - Converging channel
KW - Diverging channel
KW - MicroChannel optimization
UR - http://www.scopus.com/inward/record.url?scp=85073913096&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85073913096&partnerID=8YFLogxK
U2 - 10.1109/ITHERM.2019.8757254
DO - 10.1109/ITHERM.2019.8757254
M3 - Conference contribution
AN - SCOPUS:85073913096
T3 - InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM
SP - 1197
EP - 1203
BT - Proceedings of the 18th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2019
PB - IEEE Computer Society
T2 - 18th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2019
Y2 - 28 May 2019 through 31 May 2019
ER -