Optimal sensor placement methods for active power electronic systems

Satya R.T. Peddada, Pamela J. Tannous, Andrew G. Alleyne, James T. Allison

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Accurate temperature estimation of high density active power electronic systems is vital for dynamic thermal management. Accurate and reliable estimation is especially important in regions that are close to failure, either due to high temperature or significant materials or component sensitivity. Improved estimation can support lower safety factors and enhanced system performance. An investigation of optimal temperature sensor placement methods is presented here, focusing primarily on methods utilizing information-based metrics. In addition, physics-based metrics are explored in an initial study that may have the potential to be more closely aligned with overall system utility. Studies are based on a 2 kW, single-phase, seven-level, GaN-based inverter. A lumped-parameter reduced-order thermal model, developed in previous work, is used for real-time temperature estimation. A continuous relaxation of a 2D placement domain led to a novel linear programming formulation that supports solution of finely-discretized sensor placement problems with minimal computational expense. Improved sensor placement performance metrics account for multiple loading conditions and estimation accuracy with respect to failure prevention.

Original languageEnglish (US)
Title of host publication43rd Design Automation Conference
PublisherAmerican Society of Mechanical Engineers (ASME)
ISBN (Electronic)9780791858127
DOIs
StatePublished - 2017
EventASME 2017 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC/CIE 2017 - Cleveland, United States
Duration: Aug 6 2017Aug 9 2017

Publication series

NameProceedings of the ASME Design Engineering Technical Conference
Volume2A-2017

Other

OtherASME 2017 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC/CIE 2017
Country/TerritoryUnited States
CityCleveland
Period8/6/178/9/17

ASJC Scopus subject areas

  • Mechanical Engineering
  • Computer Graphics and Computer-Aided Design
  • Computer Science Applications
  • Modeling and Simulation

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