Optimal relaxation of I/O electrical requirements under packaging uncertainty by stochastic methods

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Fast and accurate evaluation of system failure rate is performed using stochastic collocation methods. First, we demonstrate that variability in I/O performance, such as driven voltage and slew rate, will impact failure probability of the link. For instance, higher slew rates will lead to increased levels of crosstalk between signals. Crosstalk above a certain threshold can be an indicator of system failure. Then, we demonstrate that by defining an upper bound for failure probability, an optimally relaxed set of I/O performance metrics can be generated corresponding to a stochastic interconnect model. This can be achieved by minimizing a cost function formulated with some performance metric, if these metrics are random variables. Lastly, we demonstrate that, if more information about the packaging design becomes available, the randomness of the interconnect model can be reduced, leading to a more relaxed set of I/O performance metrics. The method proposed in [1] is then be used to verify that the packaging design will meet the tolerated failure probability.

Original languageEnglish (US)
Title of host publicationProceedings - Electronic Components and Technology Conference
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages717-722
Number of pages6
ISBN (Electronic)9781479924073
DOIs
StatePublished - Sep 11 2014
Event64th Electronic Components and Technology Conference, ECTC 2014 - Orlando, United States
Duration: May 27 2014May 30 2014

Publication series

NameProceedings - Electronic Components and Technology Conference
ISSN (Print)0569-5503

Other

Other64th Electronic Components and Technology Conference, ECTC 2014
CountryUnited States
CityOrlando
Period5/27/145/30/14

    Fingerprint

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

Cite this

Chen, X., Ochoa, J. S., Schutt-Aine, J. E., & Cangellaris, A. C. (2014). Optimal relaxation of I/O electrical requirements under packaging uncertainty by stochastic methods. In Proceedings - Electronic Components and Technology Conference (pp. 717-722). [6897363] (Proceedings - Electronic Components and Technology Conference). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ECTC.2014.6897363