TY - GEN
T1 - On-chip oscilloscope for signal integrity characterization of interconnects in 130nm CMOS technology
AU - Milosevic, Pavle
AU - Schutt-Aine, Jose E
PY - 2008/12/31
Y1 - 2008/12/31
N2 - In this work, the design of a prototype chip for signal integrity characterization in 130nm CMOS technology is discussed. Measurement results for several interconnect configurations are presented. The goal is to accurately capture and characterize the transmission line properties of deep-submicron interconnects in order to generate guidelines for multi-GHz clock rate designs.
AB - In this work, the design of a prototype chip for signal integrity characterization in 130nm CMOS technology is discussed. Measurement results for several interconnect configurations are presented. The goal is to accurately capture and characterize the transmission line properties of deep-submicron interconnects in order to generate guidelines for multi-GHz clock rate designs.
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U2 - 10.1109/EPEP.2008.4675878
DO - 10.1109/EPEP.2008.4675878
M3 - Conference contribution
AN - SCOPUS:58049113506
SN - 9781424428731
T3 - Electrical Performance of Electronic Packaging, EPEP
SP - 65
EP - 68
BT - Electrical Performance of Electronic Packaging, EPEP 2008
T2 - 17th Conference on Electrical Performance of Electronic Packaging, EPEP 2008
Y2 - 27 October 2008 through 29 October 2008
ER -