TY - GEN
T1 - On-Chip ESD Protection for Multi-Gbps Automotive Serial IO in a 16-nm FinFET Process
AU - Huang, Shudong
AU - Parthasarathy, Srivatsan
AU - Zhou, Yuanzhong
AU - Hajjar, Jean Jacques
AU - Rosenbaum, Elyse
N1 - Publisher Copyright:
© 2024 ESD Association. All rights reserved.
PY - 2024
Y1 - 2024
N2 - This work presents an on-chip ESD protection architecture for high-speed automotive SerDes receivers. The ESD protection, composed of primary, secondary and auxiliary clamps, is designed to withstand system-level ESD stress. The primary protection is provided by a bidirectional SCR that can sink 15 A of 100-ns TLP current. Impedance matching and bandwidth extension are achieved by integrating the ESD protection with a T-coil circuit.
AB - This work presents an on-chip ESD protection architecture for high-speed automotive SerDes receivers. The ESD protection, composed of primary, secondary and auxiliary clamps, is designed to withstand system-level ESD stress. The primary protection is provided by a bidirectional SCR that can sink 15 A of 100-ns TLP current. Impedance matching and bandwidth extension are achieved by integrating the ESD protection with a T-coil circuit.
UR - http://www.scopus.com/inward/record.url?scp=85208419191&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85208419191&partnerID=8YFLogxK
U2 - 10.23919/EOS/ESD61719.2024.10702100
DO - 10.23919/EOS/ESD61719.2024.10702100
M3 - Conference contribution
AN - SCOPUS:85208419191
T3 - Electrical Overstress/Electrostatic Discharge Symposium Proceedings
BT - Electrical Overstress/Electrostatic Discharge Symposium Proceedings 2024, EOS/ESD 2024
PB - ESD Association
T2 - 46th Annual Electrical Overstress/Electrostatic Discharge Symposium, EOS/ESD 2024
Y2 - 16 September 2024 through 18 September 2024
ER -