TY - GEN
T1 - On a Moreau Envelope Wirelength Model for Analytical Global Placement
AU - Liao, Peiyu
AU - Liu, Hongduo
AU - Lin, Yibo
AU - Yu, Bei
AU - Wong, Martin
N1 - This work is supported by The Research Grants Council of Hong Kong SAR (No. CUHK14209420), National Science Fundation of China (No. 62141404), and The 111 Project (No. B18001). ∗Corresponding authors
PY - 2023
Y1 - 2023
N2 - Analytical placement is proven to be effective in global placement. The differentiability of wirelength models is very critical to gradient-based numerical optimization. Most previous works approximate the non-smooth half-perimeter wirelength (HPWL) model with various differentiable functions. In this paper, we propose a new differentiable wirelength model using the Moreau envelope to approximate HPWL. By combining the state-of-the-art electrostatic-based placement algorithm, the experimental results demonstrate that our proposed algorithm can achieve up to 5.4% HPWL improvement and more than 1% on average compared to the most widely-used nonlinear wirelength model.
AB - Analytical placement is proven to be effective in global placement. The differentiability of wirelength models is very critical to gradient-based numerical optimization. Most previous works approximate the non-smooth half-perimeter wirelength (HPWL) model with various differentiable functions. In this paper, we propose a new differentiable wirelength model using the Moreau envelope to approximate HPWL. By combining the state-of-the-art electrostatic-based placement algorithm, the experimental results demonstrate that our proposed algorithm can achieve up to 5.4% HPWL improvement and more than 1% on average compared to the most widely-used nonlinear wirelength model.
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U2 - 10.1109/DAC56929.2023.10247712
DO - 10.1109/DAC56929.2023.10247712
M3 - Conference contribution
AN - SCOPUS:85173110637
T3 - Proceedings - Design Automation Conference
BT - 2023 60th ACM/IEEE Design Automation Conference, DAC 2023
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 60th ACM/IEEE Design Automation Conference, DAC 2023
Y2 - 9 July 2023 through 13 July 2023
ER -