@inproceedings{b2913df30dfe46a09a1dba9b281f35f9,
title = "On a Moreau Envelope Wirelength Model for Analytical Global Placement",
abstract = "Analytical placement is proven to be effective in global placement. The differentiability of wirelength models is very critical to gradient-based numerical optimization. Most previous works approximate the non-smooth half-perimeter wirelength (HPWL) model with various differentiable functions. In this paper, we propose a new differentiable wirelength model using the Moreau envelope to approximate HPWL. By combining the state-of-the-art electrostatic-based placement algorithm, the experimental results demonstrate that our proposed algorithm can achieve up to 5.4% HPWL improvement and more than 1% on average compared to the most widely-used nonlinear wirelength model.",
author = "Peiyu Liao and Hongduo Liu and Yibo Lin and Bei Yu and Martin Wong",
note = "Publisher Copyright: {\textcopyright} 2023 IEEE.; 60th ACM/IEEE Design Automation Conference, DAC 2023 ; Conference date: 09-07-2023 Through 13-07-2023",
year = "2023",
doi = "10.1109/DAC56929.2023.10247712",
language = "English (US)",
series = "Proceedings - Design Automation Conference",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
booktitle = "2023 60th ACM/IEEE Design Automation Conference, DAC 2023",
address = "United States",
}