TY - GEN
T1 - Numerical modeling of electromgantic interference (EMI) and radiation problems for large multiscale structures
AU - Fallahpour, Mojtaba
AU - Maokun-Li,
AU - Tong, Meisong
AU - Chew, Weng Cho
N1 - Publisher Copyright:
© 2015 IEEE.
PY - 2015/12/3
Y1 - 2015/12/3
N2 - The large multiscale problems are commonly faced in real-world applications such as analysis of electromagnetic interference for a printed circuit board installed on a large platform with connected cables and wires. Unfortunately, modeling the multiscale structures is the bottleneck of electromagnetic numerical solvers. This stems from the fact that to capture objects with different scales, disparate and nonuniform meshing is unavoidable. This disparate meshing leads into different physics coexistence and consequently results in slow convergence of iterative solvers. To remedy this problem, in here, we suggest using equivalence principle algorithm which is an efficient domain decomposition method to model electromagnetic interference/radiation in the large multiscale problems.
AB - The large multiscale problems are commonly faced in real-world applications such as analysis of electromagnetic interference for a printed circuit board installed on a large platform with connected cables and wires. Unfortunately, modeling the multiscale structures is the bottleneck of electromagnetic numerical solvers. This stems from the fact that to capture objects with different scales, disparate and nonuniform meshing is unavoidable. This disparate meshing leads into different physics coexistence and consequently results in slow convergence of iterative solvers. To remedy this problem, in here, we suggest using equivalence principle algorithm which is an efficient domain decomposition method to model electromagnetic interference/radiation in the large multiscale problems.
UR - http://www.scopus.com/inward/record.url?scp=84962909905&partnerID=8YFLogxK
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U2 - 10.1109/EPEPS.2015.7347139
DO - 10.1109/EPEPS.2015.7347139
M3 - Conference contribution
AN - SCOPUS:84962909905
T3 - 2015 IEEE 24th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2015
SP - 101
EP - 104
BT - 2015 IEEE 24th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2015
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 24th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2015
Y2 - 25 October 2015 through 28 October 2015
ER -