Keyphrases
Numerical Modeling
100%
Micro Hot Embossing
100%
Embossing Process
100%
Simulation Model
66%
Finite Element Simulation
33%
Thermal Contact
33%
Poly(methyl methacrylate)
33%
Stress Relaxation
33%
Thermal Expansion
33%
Patterned Surface
33%
LED chip
33%
Prediction Accuracy
33%
Friction Effect
33%
Self-making
33%
Generalized Maxwell Model
33%
Response Surface
33%
Process Combination
33%
Contact Friction
33%
Pattern Profiles
33%
Profile Depth
33%
Deformed Pattern
33%
Face-centered Central Composite Design
33%
Surface Mount Device
33%
Engineering
Experimental Investigation
100%
Simulation Model
100%
Numerical Modeling
100%
Good Agreement
33%
Simulation Result
33%
Experimental Result
33%
Stress Relaxation
33%
Depth Profile
33%
Process Parameter
33%
Accurate Prediction
33%
Friction Effect
33%
Maxwell Model
33%
Response Surface
33%
Central Composite Design
33%
Finite Element Analysis
33%
Material Science
Finite Element Method
100%
Light-Emitting Diode
100%
Stress Relaxation
100%
Thermal Expansion
100%
Composite Material
100%
Surface (Surface Science)
100%