Numerical Modeling, Experimental Investigation, and Optimization of a Micro Hot Embossing Process

Partha Protim Mondal, Placid Matthew Ferreira, Shiv Gopal Kapoor, Patrick Bless

Research output: Contribution to journalArticlepeer-review

Abstract

This paper describes the development of a finite element simulation model and a self-made low-cost experimental setup for the micro hot embossing process. The simulation model incorporates stress relaxation behavior through the utilization of the generalized Maxwell model. It also considers thermal expansion and contact friction effects, enabling accurate prediction of the deformed pattern of polymethyl methacrylate (PMMA). Simulations and experiments were performed for various pressure and temperature combinations, and the resulting pattern profile depths were found to be in good agreement, between the simulation and experimental results. In addition, the simulation model was used to generate response surfaces through face-centered central composite design (CCD) to identify the ideal combination of process parameters of the micro hot embossing process for creating a patterned SMD (surface mount device) LED chip panel.

Original languageEnglish (US)
Article number031001
JournalJournal of Micro and Nano-Manufacturing
Volume11
Issue number3
DOIs
StatePublished - Sep 1 2023

Keywords

  • finite element simulation
  • hot embossing
  • optimization
  • PMMA deformation behavior

ASJC Scopus subject areas

  • Mechanics of Materials
  • Process Chemistry and Technology
  • Industrial and Manufacturing Engineering

Fingerprint

Dive into the research topics of 'Numerical Modeling, Experimental Investigation, and Optimization of a Micro Hot Embossing Process'. Together they form a unique fingerprint.

Cite this