Numerical investigation of radiated emissions mechanisms in single-chip packages

Gerardo Aguirre, Andreas C Cangellaris, Michael F. Pasik

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper describes an application of the Finite-Difference Time-Domain method to an indirect approach for addressing the radiation and susceptibility of electronic packages. Preliminary results indicate that the methodology is valid.

Original languageEnglish (US)
Title of host publicationProceedings - Electronic Components and Technology Conference
PublisherIEEE
Pages996-1001
Number of pages6
ISBN (Print)0780332865
DOIs
StatePublished - 1996
Externally publishedYes
EventProceedings of the 1996 IEEE 46th Electronic Components & Technology Conference, ECTC - Orlando, FL, USA
Duration: May 28 1996May 31 1996

Other

OtherProceedings of the 1996 IEEE 46th Electronic Components & Technology Conference, ECTC
CityOrlando, FL, USA
Period5/28/965/31/96

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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  • Cite this

    Aguirre, G., Cangellaris, A. C., & Pasik, M. F. (1996). Numerical investigation of radiated emissions mechanisms in single-chip packages. In Proceedings - Electronic Components and Technology Conference (pp. 996-1001). IEEE. https://doi.org/10.1109/ECTC.1996.550515