Numerical investigation of radiated emissions mechanisms in single-chip packages

Gerardo Aguirre; Andreas C. Cangellaris; Michael F. Pasik

doi:10.1109/ECTC.1996.550515

Numerical investigation of radiated emissions mechanisms in single-chip packages

Gerardo Aguirre, Andreas C. Cangellaris, Michael F. Pasik

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

This paper describes an application of the Finite-Difference Time-Domain method to an indirect approach for addressing the radiation and susceptibility of electronic packages. Preliminary results indicate that the methodology is valid.

Original language	English (US)
Title of host publication	Proceedings - Electronic Components and Technology Conference
Publisher	IEEE
Pages	996-1001
Number of pages	6
ISBN (Print)	0780332865
DOIs	https://doi.org/10.1109/ECTC.1996.550515
State	Published - 1996
Externally published	Yes
Event	Proceedings of the 1996 IEEE 46th Electronic Components & Technology Conference, ECTC - Orlando, FL, USA Duration: May 28 1996 → May 31 1996

Other

Other	Proceedings of the 1996 IEEE 46th Electronic Components & Technology Conference, ECTC
City	Orlando, FL, USA
Period	5/28/96 → 5/31/96

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Electrical and Electronic Engineering

Online availability

10.1109/ECTC.1996.550515

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Aguirre, G, Cangellaris, AC & Pasik, MF 1996, Numerical investigation of radiated emissions mechanisms in single-chip packages. in Proceedings - Electronic Components and Technology Conference. IEEE, pp. 996-1001, Proceedings of the 1996 IEEE 46th Electronic Components & Technology Conference, ECTC, Orlando, FL, USA, 5/28/96. https://doi.org/10.1109/ECTC.1996.550515

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abstract = "This paper describes an application of the Finite-Difference Time-Domain method to an indirect approach for addressing the radiation and susceptibility of electronic packages. Preliminary results indicate that the methodology is valid.",

author = "Gerardo Aguirre and Cangellaris, {Andreas C.} and Pasik, {Michael F.}",

year = "1996",

doi = "10.1109/ECTC.1996.550515",

language = "English (US)",

isbn = "0780332865",

pages = "996--1001",

booktitle = "Proceedings - Electronic Components and Technology Conference",

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M3 - Conference contribution

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ER -

Numerical investigation of radiated emissions mechanisms in single-chip packages

Abstract

Other

ASJC Scopus subject areas

Online availability

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