Novel mems apparatus for in situ thermo-mechanical tensile testing of materials at the micro- and nano-scale

J. Han; M. D. Uchic; M Taher A Saif

doi:10.1109/MEMSYS.2009.4805324

Novel mems apparatus for in situ thermo-mechanical tensile testing of materials at the micro- and nano-scale

J. Han, M. D. Uchic, M Taher A Saif

Research output: Contribution to journal › Conference article › peer-review

Abstract

We present, for the first time, a MEMS-based test methodology that potentially enables elevated-temperature mechanical tensile testing of nano- and micro-scale samples within a SEM or TEM (T > 500°C). Importantly, the test methodology allows for the samples to be fabricated separately from the MEMS-apparatus, a significant advancement from other test devices developed by some of the present authors [1]. Therefore the test methodology should be applicable to the study of a wide range of materials. Other advancements found in the methodology include a co-fabricated force calibration device, and a built-in thermocouple sensor to measure the stage temperature close to the sample.

Original language	English (US)
Article number	4805324
Pages (from-to)	80-83
Number of pages	4
Journal	Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
DOIs	https://doi.org/10.1109/MEMSYS.2009.4805324
State	Published - 2009
Event	22nd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2009 - Sorrento, Italy Duration: Jan 25 2009 → Jan 29 2009

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Mechanical Engineering
Electrical and Electronic Engineering

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10.1109/MEMSYS.2009.4805324

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title = "Novel mems apparatus for in situ thermo-mechanical tensile testing of materials at the micro- and nano-scale",

abstract = "We present, for the first time, a MEMS-based test methodology that potentially enables elevated-temperature mechanical tensile testing of nano- and micro-scale samples within a SEM or TEM (T > 500°C). Importantly, the test methodology allows for the samples to be fabricated separately from the MEMS-apparatus, a significant advancement from other test devices developed by some of the present authors [1]. Therefore the test methodology should be applicable to the study of a wide range of materials. Other advancements found in the methodology include a co-fabricated force calibration device, and a built-in thermocouple sensor to measure the stage temperature close to the sample.",

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doi = "10.1109/MEMSYS.2009.4805324",

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journal = "Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)",

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AU - Uchic, M. D.

AU - Saif, M Taher A

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N2 - We present, for the first time, a MEMS-based test methodology that potentially enables elevated-temperature mechanical tensile testing of nano- and micro-scale samples within a SEM or TEM (T > 500°C). Importantly, the test methodology allows for the samples to be fabricated separately from the MEMS-apparatus, a significant advancement from other test devices developed by some of the present authors [1]. Therefore the test methodology should be applicable to the study of a wide range of materials. Other advancements found in the methodology include a co-fabricated force calibration device, and a built-in thermocouple sensor to measure the stage temperature close to the sample.

AB - We present, for the first time, a MEMS-based test methodology that potentially enables elevated-temperature mechanical tensile testing of nano- and micro-scale samples within a SEM or TEM (T > 500°C). Importantly, the test methodology allows for the samples to be fabricated separately from the MEMS-apparatus, a significant advancement from other test devices developed by some of the present authors [1]. Therefore the test methodology should be applicable to the study of a wide range of materials. Other advancements found in the methodology include a co-fabricated force calibration device, and a built-in thermocouple sensor to measure the stage temperature close to the sample.

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JO - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

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Novel mems apparatus for in situ thermo-mechanical tensile testing of materials at the micro- and nano-scale

Abstract

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