Novel mems apparatus for in situ thermo-mechanical tensile testing of materials at the micro- and nano-scale

J. Han, M. D. Uchic, M Taher A Saif

Research output: Contribution to journalConference article

Abstract

We present, for the first time, a MEMS-based test methodology that potentially enables elevated-temperature mechanical tensile testing of nano- and micro-scale samples within a SEM or TEM (T > 500°C). Importantly, the test methodology allows for the samples to be fabricated separately from the MEMS-apparatus, a significant advancement from other test devices developed by some of the present authors [1]. Therefore the test methodology should be applicable to the study of a wide range of materials. Other advancements found in the methodology include a co-fabricated force calibration device, and a built-in thermocouple sensor to measure the stage temperature close to the sample.

Original languageEnglish (US)
Article number4805324
Pages (from-to)80-83
Number of pages4
JournalProceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
DOIs
StatePublished - Jun 1 2009
Event22nd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2009 - Sorrento, Italy
Duration: Jan 25 2009Jan 29 2009

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ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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