Novel mems apparatus for in situ thermo-mechanical tensile testing of materials at the micro- and nano-scale

J. Han, M. D. Uchic, M Taher A Saif

Research output: Contribution to journalConference article

Abstract

We present, for the first time, a MEMS-based test methodology that potentially enables elevated-temperature mechanical tensile testing of nano- and micro-scale samples within a SEM or TEM (T > 500°C). Importantly, the test methodology allows for the samples to be fabricated separately from the MEMS-apparatus, a significant advancement from other test devices developed by some of the present authors [1]. Therefore the test methodology should be applicable to the study of a wide range of materials. Other advancements found in the methodology include a co-fabricated force calibration device, and a built-in thermocouple sensor to measure the stage temperature close to the sample.

Original languageEnglish (US)
Article number4805324
Pages (from-to)80-83
Number of pages4
JournalProceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
DOIs
StatePublished - Jun 1 2009
Event22nd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2009 - Sorrento, Italy
Duration: Jan 25 2009Jan 29 2009

Fingerprint

Mechanical testing
Tensile testing
MEMS
methodology
Thermocouples
microelectromechanical systems
Calibration
Transmission electron microscopy
Temperature
Scanning electron microscopy
Sensors
thermocouples
transmission electron microscopy
scanning electron microscopy
temperature
sensors

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Mechanical Engineering
  • Electrical and Electronic Engineering

Cite this

@article{fde199e97b9b457ab9b696b8d672f496,
title = "Novel mems apparatus for in situ thermo-mechanical tensile testing of materials at the micro- and nano-scale",
abstract = "We present, for the first time, a MEMS-based test methodology that potentially enables elevated-temperature mechanical tensile testing of nano- and micro-scale samples within a SEM or TEM (T > 500°C). Importantly, the test methodology allows for the samples to be fabricated separately from the MEMS-apparatus, a significant advancement from other test devices developed by some of the present authors [1]. Therefore the test methodology should be applicable to the study of a wide range of materials. Other advancements found in the methodology include a co-fabricated force calibration device, and a built-in thermocouple sensor to measure the stage temperature close to the sample.",
author = "J. Han and Uchic, {M. D.} and Saif, {M Taher A}",
year = "2009",
month = "6",
day = "1",
doi = "10.1109/MEMSYS.2009.4805324",
language = "English (US)",
pages = "80--83",
journal = "Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)",
issn = "1084-6999",
publisher = "Institute of Electrical and Electronics Engineers Inc.",

}

TY - JOUR

T1 - Novel mems apparatus for in situ thermo-mechanical tensile testing of materials at the micro- and nano-scale

AU - Han, J.

AU - Uchic, M. D.

AU - Saif, M Taher A

PY - 2009/6/1

Y1 - 2009/6/1

N2 - We present, for the first time, a MEMS-based test methodology that potentially enables elevated-temperature mechanical tensile testing of nano- and micro-scale samples within a SEM or TEM (T > 500°C). Importantly, the test methodology allows for the samples to be fabricated separately from the MEMS-apparatus, a significant advancement from other test devices developed by some of the present authors [1]. Therefore the test methodology should be applicable to the study of a wide range of materials. Other advancements found in the methodology include a co-fabricated force calibration device, and a built-in thermocouple sensor to measure the stage temperature close to the sample.

AB - We present, for the first time, a MEMS-based test methodology that potentially enables elevated-temperature mechanical tensile testing of nano- and micro-scale samples within a SEM or TEM (T > 500°C). Importantly, the test methodology allows for the samples to be fabricated separately from the MEMS-apparatus, a significant advancement from other test devices developed by some of the present authors [1]. Therefore the test methodology should be applicable to the study of a wide range of materials. Other advancements found in the methodology include a co-fabricated force calibration device, and a built-in thermocouple sensor to measure the stage temperature close to the sample.

UR - http://www.scopus.com/inward/record.url?scp=65949107870&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=65949107870&partnerID=8YFLogxK

U2 - 10.1109/MEMSYS.2009.4805324

DO - 10.1109/MEMSYS.2009.4805324

M3 - Conference article

AN - SCOPUS:65949107870

SP - 80

EP - 83

JO - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

JF - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

SN - 1084-6999

M1 - 4805324

ER -