Noninvasive real-time evaluation of the anisotropic thermal diffusivity in thin polymer films for electronics packaging

John A. Rogers, C. Mindas, Y. Yang, K. A. Nelson

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

We describe an experimental method capable of evaluating the in- and out-of-plane components of the anisotropic thermal diffusivity in supported and unsupported thin polymer films. The technique is used to quantify the in-plane thermal diffusivity in films of PMDA/ODA (Dupont's PI2545), BTDA/ODA/MPD (Dupont's PI2555), BPDA/PPD (Dupont's PI2611), BCB (Dow's Cyclotene 3022) and HFDA-APBP (Amoco's UD4212) with thicknesses in the 1-10 micron range.

Original languageEnglish (US)
Title of host publicationElectronic Packaging Materials Science VII
EditorsPeter Borgesen, Klavs F. Jensen, Roger A. Pollak
PublisherPubl by Materials Research Society
Pages441-445
Number of pages5
ISBN (Print)1558992227
StatePublished - 1994
EventProceedings of the Fall 1993 MRS Meeting - Boston, MA, USA
Duration: Nov 29 1993Dec 3 1993

Publication series

NameMaterials Research Society Symposium Proceedings
Volume323
ISSN (Print)0272-9172

Other

OtherProceedings of the Fall 1993 MRS Meeting
CityBoston, MA, USA
Period11/29/9312/3/93

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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