Abstract
Intense electron-phonon scattering near the peak electric field in a semiconductor device results in nanometer-scale phonon hotspots. Past studies have argued that ballistic phonon transport near such hotspots serves to restrict heat conduction. We reexamine this assertion by developing a new phonon transport model. In a departure from previous studies, we treat isotropic dispersion in all phonon branches and include a phonon emission spectrum from independent Monte Carlo simulations of electron-phonon scattering. We cast the model in terms of a non-equilibrium phonon distribution function and compare predictions from this model with data for ballistic transport in silicon. The solution to the steady-state transport equations for bulk silicon transistors shows that energy stagnation at the hotspot results in an excess equivalent temperature rise of about 13% in a 90 nm gate-length device. Longitudinal optical phonons with non-zero group velocities dominate transport. We find that the resistance associated with ballistic transport does not overwhelm that from the package unless the peak power density approaches 50 W/μm3. A transient calculation shows negligible phonon accumulation and retardation between successive logic states. This work highlights and reduces the knowledge gaps in the electro-thermal simulation of transistors.
Original language | English (US) |
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Pages (from-to) | 638-647 |
Number of pages | 10 |
Journal | Journal of Heat Transfer |
Volume | 128 |
Issue number | 7 |
DOIs | |
State | Published - Jul 2006 |
Externally published | Yes |
Keywords
- Devices
- Heat transfer
- Modeling
- Nanoscale
- Thermophysical
ASJC Scopus subject areas
- General Materials Science
- Condensed Matter Physics
- Mechanics of Materials
- Mechanical Engineering