Non-contact transfer printing

Reza Saeidpourazar (Inventor), Placid M Ferreira (Inventor), John A Rogers (Inventor)

Research output: Patent

Abstract

A transfer printing process that exploits the mismatch in mechanical or thermo-mechanical response at the interface of a printable micro- or nano-device and a transfer stamp to drive the release of the device from the stamp and its non-contact transfer to a receiving substrate are provided. The resulting facile, pick-and-place process is demonstrated with the assembling of 3-D microdevices and the printing of GAN light-emitting diodes onto silicon and glass substrates. High speed photography is used to provide experimental evidence of thermo-mechanically driven release.
Original languageEnglish (US)
U.S. patent number9555644
StatePublished - Jan 31 2017

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