Abstract

A transfer printing process that exploits the mismatch in mechanical or thermo-mechanical response at the interface of a printable micro- or nano-device and a transfer stamp to drive the release of the device from the stamp and its non-contact transfer to a receiving substrate are provided. The resulting facile, pick-and-place process is demonstrated with the assembling of 3-D microdevices and the printing of GAN light-emitting diodes onto silicon and glass substrates. High speed photography is used to provide experimental evidence of thermo-mechanically driven release.
Original languageEnglish (US)
U.S. patent number10029451
StatePublished - Jul 24 2018

Fingerprint

Dive into the research topics of 'Non-contact transfer printing'. Together they form a unique fingerprint.

Cite this