Abstract
In this paper we propose a new method for moment calculation appropriate for dispersive, lossy interconnects and related package discontinuities, transitions and junctions that are modeled in terms of either numerically extracted or measured frequency-dependent scattering parameters. The method first constructs a local rational function approximation to the frequency domain measured data around an expansion point, and then finds the moments easily from the rational function. Comparisons with real measurements are presented which demonstrate the validity and accuracy of the proposed method.
Original language | English (US) |
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Pages | 196-201 |
Number of pages | 6 |
State | Published - 1996 |
Externally published | Yes |
Event | Proceedings of the 1996 IEEE Multi-Chip Module Conference - Santa Cruz, CA, USA Duration: Feb 6 1996 → Feb 7 1996 |
Other
Other | Proceedings of the 1996 IEEE Multi-Chip Module Conference |
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City | Santa Cruz, CA, USA |
Period | 2/6/96 → 2/7/96 |
ASJC Scopus subject areas
- Electrical and Electronic Engineering