New moment generation technique for interconnects characterized by measured or calculated S-parameters

M. Celik, Andreas C Cangellaris, A. Deutsch

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In this paper we propose a new method for moment calculation appropriate for dispersive, lossy interconnects and related package discontinuities, transitions and junctions that are modeled in terms of either numerically extracted or measured frequency-dependent scattering parameters. The method first constructs a local rational function approximation to the frequency domain measured data around an expansion point, and then finds the moments easily from the rational function. Comparisons with real measurements are presented which demonstrate the validity and accuracy of the proposed method.

Original languageEnglish (US)
Title of host publicationProceedings of the IEEE Multi-Chip Module Conference
PublisherIEEE
Pages196-201
Number of pages6
StatePublished - 1996
Externally publishedYes
EventProceedings of the 1996 IEEE Multi-Chip Module Conference - Santa Cruz, CA, USA
Duration: Feb 6 1996Feb 7 1996

Other

OtherProceedings of the 1996 IEEE Multi-Chip Module Conference
CitySanta Cruz, CA, USA
Period2/6/962/7/96

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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  • Cite this

    Celik, M., Cangellaris, A. C., & Deutsch, A. (1996). New moment generation technique for interconnects characterized by measured or calculated S-parameters. In Proceedings of the IEEE Multi-Chip Module Conference (pp. 196-201). IEEE.