New Loss Function for Learning Dielectric Thickness Distributions and Generative Modeling of Breakdown Lifetime

Weiman Yan, Ernest Wu, Elyse Rosenbaum

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This work introduces a new loss function for modeling dielectric lifetime distributions with thickness nonuniformity. It is applicable to both maximum likelihood estimation and to a previously introduced machine learning (ML) framework, providing better agreement between measurement data and generated distributions. The ML method is used to model die and wafer level lifetime distributions and thickness variation. An analytic expression relating dielectric thickness to leakage current or vice versa can be extracted.

Original languageEnglish (US)
Title of host publication2025 IEEE International Reliability Physics Symposium, IRPS 2025 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9798331504779
DOIs
StatePublished - 2025
Event2025 IEEE International Reliability Physics Symposium, IRPS 2025 - Monterey, United States
Duration: Mar 30 2025Apr 3 2025

Publication series

NameIEEE International Reliability Physics Symposium Proceedings
ISSN (Print)1541-7026

Conference

Conference2025 IEEE International Reliability Physics Symposium, IRPS 2025
Country/TerritoryUnited States
CityMonterey
Period3/30/254/3/25

Keywords

  • lifetime distribution
  • machine learning
  • TDDB
  • Time-dependent dielectric breakdown

ASJC Scopus subject areas

  • General Engineering

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