TY - GEN
T1 - Nanostructuring Of Metallic Additively Manufactured Surfaces For Enhanced Jumping Droplet Condensation
AU - Ho, Jin Yao
AU - Rabbi, Kazi Fazle
AU - Sett, Soumyadip
AU - Wong, Teck Neng
AU - Leong, Kai Choong
AU - Miljkovic, Nenad
N1 - Publisher Copyright:
© 2021 by ASME.
PY - 2021
Y1 - 2021
N2 - Vapor condensation on metallic surfaces is a phasechange phenomenon that has widespread applications in many processes. Jumping-droplet-enhanced condensation is an effective mode of dropwise condensation due to its higher droplet removal rate, enabling more efficient heat transfer. However, maintaining stable jumping-droplet condensation, requires surface structures to be suitably designed to prevent droplet pinning and surface flooding. In recent years, using metal additive manufacturing (AM) processes to create heat exchanger surfaces has received significant attention due to its design freedom and versatility in fabricating highly complex functional parts. Here, we present a highly scalable method of fabricating superhydrophobic (SHP) AM surfaces from aluminum alloy, AlSi10Mg, and an experimental investigation of their thermal performance during steam condensation. The test samples were fabricated by Selective Laser Melting (SLM), an AM technique for producing metallic parts. Through detailed material characterizations, we found that it is possible to achieve superior superhydrophobicity on AM surfaces, with unique cellularlike nanoscale surface features, by simple chemical etching and functionalization processes. To understand the droplet dynamics and obtain insights on the effects of AM nanostructures on the condensate droplet morphology and jumping, we carried out condensation experiments with an environmental scanning electron microscope (ESEM) at low supersaturation of ~1.06. The important relations between the fabricated AM nanostructure morphology and droplet dynamics are established by characterizing the droplet departure diameter and droplet jumping frequency. To determine the antiflooding and condensation heat transfer performances of the AM SHP surfaces, pure vapor condensation experiments under higher supersaturation conditions were carried out in a well-controlled environmental chamber. Together with the aid of high-resolution imaging and heat transfer measurements, we demonstrate significant reduction in droplet pinning sites due to the implementation of the AM cellular-like structure. This reduces the thermal barrier between the condensing surface and surrounding vapor, and hence, increases the condensation heat transfer. Our results show that excellent droplet jumping performance and better droplet mobility can be achieved by using AM SHP surfaces as compared to conventional SHP aluminum extruded tubing. These results underscore the potential of advancing AM structured surfaces for jumping-droplet-enhanced condensation under high heat flux conditions.
AB - Vapor condensation on metallic surfaces is a phasechange phenomenon that has widespread applications in many processes. Jumping-droplet-enhanced condensation is an effective mode of dropwise condensation due to its higher droplet removal rate, enabling more efficient heat transfer. However, maintaining stable jumping-droplet condensation, requires surface structures to be suitably designed to prevent droplet pinning and surface flooding. In recent years, using metal additive manufacturing (AM) processes to create heat exchanger surfaces has received significant attention due to its design freedom and versatility in fabricating highly complex functional parts. Here, we present a highly scalable method of fabricating superhydrophobic (SHP) AM surfaces from aluminum alloy, AlSi10Mg, and an experimental investigation of their thermal performance during steam condensation. The test samples were fabricated by Selective Laser Melting (SLM), an AM technique for producing metallic parts. Through detailed material characterizations, we found that it is possible to achieve superior superhydrophobicity on AM surfaces, with unique cellularlike nanoscale surface features, by simple chemical etching and functionalization processes. To understand the droplet dynamics and obtain insights on the effects of AM nanostructures on the condensate droplet morphology and jumping, we carried out condensation experiments with an environmental scanning electron microscope (ESEM) at low supersaturation of ~1.06. The important relations between the fabricated AM nanostructure morphology and droplet dynamics are established by characterizing the droplet departure diameter and droplet jumping frequency. To determine the antiflooding and condensation heat transfer performances of the AM SHP surfaces, pure vapor condensation experiments under higher supersaturation conditions were carried out in a well-controlled environmental chamber. Together with the aid of high-resolution imaging and heat transfer measurements, we demonstrate significant reduction in droplet pinning sites due to the implementation of the AM cellular-like structure. This reduces the thermal barrier between the condensing surface and surrounding vapor, and hence, increases the condensation heat transfer. Our results show that excellent droplet jumping performance and better droplet mobility can be achieved by using AM SHP surfaces as compared to conventional SHP aluminum extruded tubing. These results underscore the potential of advancing AM structured surfaces for jumping-droplet-enhanced condensation under high heat flux conditions.
KW - Additive manufacturing
KW - Condensation
KW - Jumping droplet
KW - Steam
KW - Superhydrophobic
UR - http://www.scopus.com/inward/record.url?scp=85124427973&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85124427973&partnerID=8YFLogxK
U2 - 10.1115/IMECE2021-70949
DO - 10.1115/IMECE2021-70949
M3 - Conference contribution
AN - SCOPUS:85124427973
T3 - ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)
BT - Heat Transfer and Thermal Engineering
PB - American Society of Mechanical Engineers (ASME)
T2 - ASME 2021 International Mechanical Engineering Congress and Exposition, IMECE 2021
Y2 - 1 November 2021 through 5 November 2021
ER -