Abstract
Cu nanoscale spring films fabricated by Glancing Angle Deposition (GLAD) were studied for their mechanical compliance and reversible compressibility as a function of their spacing that varied in the range of 2000 - 3200 nm. The mechanical behavior under compression was measured from 200 μm2 areas of nanospring films with the aid of a nanoindenter. The compressive modulus was as low as 200 MPa and increased with applied stress due to the intertwined nature of nanosprings, which came in contact upon compression. At small applied stresses (<5 MPa), the Cu nanospring films were ~500 times more compliant than bulk Cu, while they experienced no permanent deformation for compressive stresses as high as 25 MPa.
| Original language | English (US) |
|---|---|
| State | Published - 2015 |
| Event | 20th International Conference on Composite Materials, ICCM 2015 - Copenhagen, Denmark Duration: Jul 19 2015 → Jul 24 2015 |
Other
| Other | 20th International Conference on Composite Materials, ICCM 2015 |
|---|---|
| Country/Territory | Denmark |
| City | Copenhagen |
| Period | 7/19/15 → 7/24/15 |
Keywords
- Interfaces
- Interfacial improvement
- Thermo-mechanical coupling
ASJC Scopus subject areas
- General Engineering
- Ceramics and Composites