Nanosoldering carbon nanotube junctions with metal via local chemical vapor deposition for improved device performance

Jae Won Do, David Estrada, Xu Xie, Noel N. Chang, Gregory S Girolami, John A Rogers, Eric Pop, Joseph W Lyding

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Carbon nanotube (CNT) network devices are useful in integrated circuits and display drivers, particularly in applications that make use of thin film transistors. However, in such devices, the performance is usually limited by high electrical and thermal resistances at the inter-tube junctions. The current research presents a novel method to improve such resistances using a localized chemical vapor deposition (CVD) process. As these junctions are the most-resistive regions, we are able to locally heat and selectively deposit metals at the junctions by passing currents through the CNT network in the presence of metal CVD precursors in a vacuum environment, thereby nanosoldering the inter-tube junctions. We show that the metals indeed start to form at the junctions, which directly indicates that the inter-tube junctions are indeed the spots of high thermal resistance. We also show that the effects of nanosoldering are dependent on the types of metals deposited, and furthermore, our nanosoldering technique can effectively improve the overall device performance by more than an order of magnitude

Original languageEnglish (US)
Title of host publication2012 12th IEEE International Conference on Nanotechnology, NANO 2012
DOIs
StatePublished - Nov 22 2012
Event2012 12th IEEE International Conference on Nanotechnology, NANO 2012 - Birmingham, United Kingdom
Duration: Aug 20 2012Aug 23 2012

Publication series

NameProceedings of the IEEE Conference on Nanotechnology
ISSN (Print)1944-9399
ISSN (Electronic)1944-9380

Other

Other2012 12th IEEE International Conference on Nanotechnology, NANO 2012
CountryUnited Kingdom
CityBirmingham
Period8/20/128/23/12

Fingerprint

Carbon Nanotubes
Chemical vapor deposition
Carbon nanotubes
Metals
carbon nanotubes
vapor deposition
Heat resistance
metals
thermal resistance
tubes
Acoustic impedance
Thin film transistors
Integrated circuits
Deposits
Display devices
Vacuum
electrical resistance
integrated circuits
transistors
deposits

ASJC Scopus subject areas

  • Bioengineering
  • Electrical and Electronic Engineering
  • Materials Chemistry
  • Condensed Matter Physics

Cite this

Do, J. W., Estrada, D., Xie, X., Chang, N. N., Girolami, G. S., Rogers, J. A., ... Lyding, J. W. (2012). Nanosoldering carbon nanotube junctions with metal via local chemical vapor deposition for improved device performance. In 2012 12th IEEE International Conference on Nanotechnology, NANO 2012 [6322102] (Proceedings of the IEEE Conference on Nanotechnology). https://doi.org/10.1109/NANO.2012.6322102

Nanosoldering carbon nanotube junctions with metal via local chemical vapor deposition for improved device performance. / Do, Jae Won; Estrada, David; Xie, Xu; Chang, Noel N.; Girolami, Gregory S; Rogers, John A; Pop, Eric; Lyding, Joseph W.

2012 12th IEEE International Conference on Nanotechnology, NANO 2012. 2012. 6322102 (Proceedings of the IEEE Conference on Nanotechnology).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Do, JW, Estrada, D, Xie, X, Chang, NN, Girolami, GS, Rogers, JA, Pop, E & Lyding, JW 2012, Nanosoldering carbon nanotube junctions with metal via local chemical vapor deposition for improved device performance. in 2012 12th IEEE International Conference on Nanotechnology, NANO 2012., 6322102, Proceedings of the IEEE Conference on Nanotechnology, 2012 12th IEEE International Conference on Nanotechnology, NANO 2012, Birmingham, United Kingdom, 8/20/12. https://doi.org/10.1109/NANO.2012.6322102
Do JW, Estrada D, Xie X, Chang NN, Girolami GS, Rogers JA et al. Nanosoldering carbon nanotube junctions with metal via local chemical vapor deposition for improved device performance. In 2012 12th IEEE International Conference on Nanotechnology, NANO 2012. 2012. 6322102. (Proceedings of the IEEE Conference on Nanotechnology). https://doi.org/10.1109/NANO.2012.6322102
Do, Jae Won ; Estrada, David ; Xie, Xu ; Chang, Noel N. ; Girolami, Gregory S ; Rogers, John A ; Pop, Eric ; Lyding, Joseph W. / Nanosoldering carbon nanotube junctions with metal via local chemical vapor deposition for improved device performance. 2012 12th IEEE International Conference on Nanotechnology, NANO 2012. 2012. (Proceedings of the IEEE Conference on Nanotechnology).
@inproceedings{d66a117c285a430da1d63f61e6cc37ce,
title = "Nanosoldering carbon nanotube junctions with metal via local chemical vapor deposition for improved device performance",
abstract = "Carbon nanotube (CNT) network devices are useful in integrated circuits and display drivers, particularly in applications that make use of thin film transistors. However, in such devices, the performance is usually limited by high electrical and thermal resistances at the inter-tube junctions. The current research presents a novel method to improve such resistances using a localized chemical vapor deposition (CVD) process. As these junctions are the most-resistive regions, we are able to locally heat and selectively deposit metals at the junctions by passing currents through the CNT network in the presence of metal CVD precursors in a vacuum environment, thereby nanosoldering the inter-tube junctions. We show that the metals indeed start to form at the junctions, which directly indicates that the inter-tube junctions are indeed the spots of high thermal resistance. We also show that the effects of nanosoldering are dependent on the types of metals deposited, and furthermore, our nanosoldering technique can effectively improve the overall device performance by more than an order of magnitude",
author = "Do, {Jae Won} and David Estrada and Xu Xie and Chang, {Noel N.} and Girolami, {Gregory S} and Rogers, {John A} and Eric Pop and Lyding, {Joseph W}",
year = "2012",
month = "11",
day = "22",
doi = "10.1109/NANO.2012.6322102",
language = "English (US)",
isbn = "9781467321983",
series = "Proceedings of the IEEE Conference on Nanotechnology",
booktitle = "2012 12th IEEE International Conference on Nanotechnology, NANO 2012",

}

TY - GEN

T1 - Nanosoldering carbon nanotube junctions with metal via local chemical vapor deposition for improved device performance

AU - Do, Jae Won

AU - Estrada, David

AU - Xie, Xu

AU - Chang, Noel N.

AU - Girolami, Gregory S

AU - Rogers, John A

AU - Pop, Eric

AU - Lyding, Joseph W

PY - 2012/11/22

Y1 - 2012/11/22

N2 - Carbon nanotube (CNT) network devices are useful in integrated circuits and display drivers, particularly in applications that make use of thin film transistors. However, in such devices, the performance is usually limited by high electrical and thermal resistances at the inter-tube junctions. The current research presents a novel method to improve such resistances using a localized chemical vapor deposition (CVD) process. As these junctions are the most-resistive regions, we are able to locally heat and selectively deposit metals at the junctions by passing currents through the CNT network in the presence of metal CVD precursors in a vacuum environment, thereby nanosoldering the inter-tube junctions. We show that the metals indeed start to form at the junctions, which directly indicates that the inter-tube junctions are indeed the spots of high thermal resistance. We also show that the effects of nanosoldering are dependent on the types of metals deposited, and furthermore, our nanosoldering technique can effectively improve the overall device performance by more than an order of magnitude

AB - Carbon nanotube (CNT) network devices are useful in integrated circuits and display drivers, particularly in applications that make use of thin film transistors. However, in such devices, the performance is usually limited by high electrical and thermal resistances at the inter-tube junctions. The current research presents a novel method to improve such resistances using a localized chemical vapor deposition (CVD) process. As these junctions are the most-resistive regions, we are able to locally heat and selectively deposit metals at the junctions by passing currents through the CNT network in the presence of metal CVD precursors in a vacuum environment, thereby nanosoldering the inter-tube junctions. We show that the metals indeed start to form at the junctions, which directly indicates that the inter-tube junctions are indeed the spots of high thermal resistance. We also show that the effects of nanosoldering are dependent on the types of metals deposited, and furthermore, our nanosoldering technique can effectively improve the overall device performance by more than an order of magnitude

UR - http://www.scopus.com/inward/record.url?scp=84869178306&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84869178306&partnerID=8YFLogxK

U2 - 10.1109/NANO.2012.6322102

DO - 10.1109/NANO.2012.6322102

M3 - Conference contribution

SN - 9781467321983

T3 - Proceedings of the IEEE Conference on Nanotechnology

BT - 2012 12th IEEE International Conference on Nanotechnology, NANO 2012

ER -