Nanosoldering carbon nanotube junctions by local chemical vapor deposition for improved device performance

Jae Won Do, David Estrada, Xu Xie, Noel N. Chang, Justin Mallek, Gregory S. Girolami, John A. Rogers, Eric Pop, Joseph W. Lyding

Research output: Contribution to journalArticle

Abstract

The performance of carbon nanotube network (CNN) devices is usually limited by the high resistance of individual nanotube junctions (NJs). We present a novel method to reduce this resistance through a nanoscale chemical vapor deposition (CVD) process. By passing current through the devices in the presence of a gaseous CVD precursor, localized nanoscale Joule heating induced at the NJs stimulates the selective and self-limiting deposition of metallic nanosolder. The effectiveness of this nanosoldering process depends on the work function of the deposited metal (here Pd or HfB2), and it can improve the on/off current ratio of a CNN device by nearly an order of magnitude. This nanosoldering technique could also be applied to other device types where nanoscale resistance components limit overall device performance.

Original languageEnglish (US)
Pages (from-to)5844-5850
Number of pages7
JournalNano letters
Volume13
Issue number12
DOIs
StatePublished - Dec 11 2013

Keywords

  • Carbon nanotubes (CNT)
  • electrical resistance
  • intertube junctions
  • local chemical vapor deposition (CVD)
  • nanosoldering
  • thermal resistance

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Bioengineering
  • Chemistry(all)
  • Materials Science(all)
  • Mechanical Engineering

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