Multiscale systems engineering with application to copper electrodeposition

Mohan Karulkar, Feng Xue, Timothy O. Drews, Yuan He, Xiaohai Li, Effendi Rusli, Richard C. Alkire, Richard D. Braatz

Research output: Contribution to conferencePaper

Original languageEnglish (US)
Pages10688-10690
Number of pages3
StatePublished - Dec 1 2005
Externally publishedYes
Event05AIChE: 2005 AIChE Annual Meeting and Fall Showcase - Cincinnati, OH, United States
Duration: Oct 30 2005Nov 4 2005

Other

Other05AIChE: 2005 AIChE Annual Meeting and Fall Showcase
CountryUnited States
CityCincinnati, OH
Period10/30/0511/4/05

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Karulkar, M., Xue, F., Drews, T. O., He, Y., Li, X., Rusli, E., Alkire, R. C., & Braatz, R. D. (2005). Multiscale systems engineering with application to copper electrodeposition. 10688-10690. Paper presented at 05AIChE: 2005 AIChE Annual Meeting and Fall Showcase, Cincinnati, OH, United States.