Multiscale simulations of copper electrodeposition onto a resistive substrate

Timothy O. Drews, Sriram Krishnan, Jay Alameda, Dennis Gannon, Richard D. Braatz, Richard C Alkire

Research output: Contribution to journalArticle

Abstract

During the initial stages of copper electrodeposition onto a thin seed layer, a nonuniform potential distribution arises, resulting in local variations in growth rate and deposit morphology. Early stages of morphology evolution during copper electrodeposition are of practical importance but have not been well studied. Here, a new multiscale approach is developed for numerical simulation of the effect of a macroscopic potential distribution along a seed layer on microscopic local roughness evolution. The key contribution is a generic method for coupling multiple computer codes, and the demonstration of its use. The macroscopic code passes the local potential at ten points along the seed layer to ten kinetic Monte Carlo codes, each of which simulates additive-free copper electrodeposition and roughness evolution on an initially flat surface. Periodically, each Monte Carlo code computes the local film thickness and passes it back to the resistance code, which updates the potential distribution for the next iteration. Results are obtained for a wide range of parameter space including both constant-potential and constant-current operation. A confirmation procedure was developed to verify that the multiscale approach (using small Monte Carlo simulation domains with periodic boundary conditions) does not significantly alter the physical accuracy of the simulations.

Original languageEnglish (US)
Pages (from-to)49-63
Number of pages15
JournalIBM Journal of Research and Development
Volume49
Issue number1
DOIs
StatePublished - Jan 2005

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Electrodeposition
Seed
Copper
Substrates
Surface roughness
Film thickness
Demonstrations
Deposits
Boundary conditions
Kinetics
Computer simulation

ASJC Scopus subject areas

  • Computer Science(all)

Cite this

Multiscale simulations of copper electrodeposition onto a resistive substrate. / Drews, Timothy O.; Krishnan, Sriram; Alameda, Jay; Gannon, Dennis; Braatz, Richard D.; Alkire, Richard C.

In: IBM Journal of Research and Development, Vol. 49, No. 1, 01.2005, p. 49-63.

Research output: Contribution to journalArticle

Drews, Timothy O. ; Krishnan, Sriram ; Alameda, Jay ; Gannon, Dennis ; Braatz, Richard D. ; Alkire, Richard C. / Multiscale simulations of copper electrodeposition onto a resistive substrate. In: IBM Journal of Research and Development. 2005 ; Vol. 49, No. 1. pp. 49-63.
@article{66f2bd77fb5b4aeaa489507b508ace53,
title = "Multiscale simulations of copper electrodeposition onto a resistive substrate",
abstract = "During the initial stages of copper electrodeposition onto a thin seed layer, a nonuniform potential distribution arises, resulting in local variations in growth rate and deposit morphology. Early stages of morphology evolution during copper electrodeposition are of practical importance but have not been well studied. Here, a new multiscale approach is developed for numerical simulation of the effect of a macroscopic potential distribution along a seed layer on microscopic local roughness evolution. The key contribution is a generic method for coupling multiple computer codes, and the demonstration of its use. The macroscopic code passes the local potential at ten points along the seed layer to ten kinetic Monte Carlo codes, each of which simulates additive-free copper electrodeposition and roughness evolution on an initially flat surface. Periodically, each Monte Carlo code computes the local film thickness and passes it back to the resistance code, which updates the potential distribution for the next iteration. Results are obtained for a wide range of parameter space including both constant-potential and constant-current operation. A confirmation procedure was developed to verify that the multiscale approach (using small Monte Carlo simulation domains with periodic boundary conditions) does not significantly alter the physical accuracy of the simulations.",
author = "Drews, {Timothy O.} and Sriram Krishnan and Jay Alameda and Dennis Gannon and Braatz, {Richard D.} and Alkire, {Richard C}",
year = "2005",
month = "1",
doi = "10.1147/rd.491.0049",
language = "English (US)",
volume = "49",
pages = "49--63",
journal = "IBM Journal of Research and Development",
issn = "0018-8646",
publisher = "IBM Corporation",
number = "1",

}

TY - JOUR

T1 - Multiscale simulations of copper electrodeposition onto a resistive substrate

AU - Drews, Timothy O.

AU - Krishnan, Sriram

AU - Alameda, Jay

AU - Gannon, Dennis

AU - Braatz, Richard D.

AU - Alkire, Richard C

PY - 2005/1

Y1 - 2005/1

N2 - During the initial stages of copper electrodeposition onto a thin seed layer, a nonuniform potential distribution arises, resulting in local variations in growth rate and deposit morphology. Early stages of morphology evolution during copper electrodeposition are of practical importance but have not been well studied. Here, a new multiscale approach is developed for numerical simulation of the effect of a macroscopic potential distribution along a seed layer on microscopic local roughness evolution. The key contribution is a generic method for coupling multiple computer codes, and the demonstration of its use. The macroscopic code passes the local potential at ten points along the seed layer to ten kinetic Monte Carlo codes, each of which simulates additive-free copper electrodeposition and roughness evolution on an initially flat surface. Periodically, each Monte Carlo code computes the local film thickness and passes it back to the resistance code, which updates the potential distribution for the next iteration. Results are obtained for a wide range of parameter space including both constant-potential and constant-current operation. A confirmation procedure was developed to verify that the multiscale approach (using small Monte Carlo simulation domains with periodic boundary conditions) does not significantly alter the physical accuracy of the simulations.

AB - During the initial stages of copper electrodeposition onto a thin seed layer, a nonuniform potential distribution arises, resulting in local variations in growth rate and deposit morphology. Early stages of morphology evolution during copper electrodeposition are of practical importance but have not been well studied. Here, a new multiscale approach is developed for numerical simulation of the effect of a macroscopic potential distribution along a seed layer on microscopic local roughness evolution. The key contribution is a generic method for coupling multiple computer codes, and the demonstration of its use. The macroscopic code passes the local potential at ten points along the seed layer to ten kinetic Monte Carlo codes, each of which simulates additive-free copper electrodeposition and roughness evolution on an initially flat surface. Periodically, each Monte Carlo code computes the local film thickness and passes it back to the resistance code, which updates the potential distribution for the next iteration. Results are obtained for a wide range of parameter space including both constant-potential and constant-current operation. A confirmation procedure was developed to verify that the multiscale approach (using small Monte Carlo simulation domains with periodic boundary conditions) does not significantly alter the physical accuracy of the simulations.

UR - http://www.scopus.com/inward/record.url?scp=13844275833&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=13844275833&partnerID=8YFLogxK

U2 - 10.1147/rd.491.0049

DO - 10.1147/rd.491.0049

M3 - Article

AN - SCOPUS:13844275833

VL - 49

SP - 49

EP - 63

JO - IBM Journal of Research and Development

JF - IBM Journal of Research and Development

SN - 0018-8646

IS - 1

ER -