Multiphysics Simulation of 3-D ICs with Integrated Microchannel Cooling

Tianjian Lu, Feini Zhang, Jian Ming Jin

Research output: Contribution to journalArticlepeer-review

Abstract

A multiphysics-based co-simulation technique is developed based on the finite element method for the characterization of 3-D high-frequency integrated circuits (ICs) with integrated microchannel cooling. The multiphysics in the co-simulation includes full-wave electromagnetic, fluid, and transient conjugate heat transfer analyses. For incompressible and fully developed flows, the governing equations of fluid flow are decoupled from temperature, and the velocity field is obtained analytically. The full-wave electromagnetic and the transient conjugate heat transfer analyses are coupled through temperature-dependent material properties. The efficiency of the co-simulation is enhanced through an adaptive time-stepping scheme, a domain decomposition scheme called the finite element tearing and interconnecting (FETI), and FETI-enabled parallel computing. The capability and the efficiency of the proposed co-simulation in analyzing practical and large-scale 3-D ICs are demonstrated through numerical examples. The effectiveness of heat removal through integrated microchannel cooling and the thermal impact on high-frequency characteristics of 3-D IC designs are also demonstrated.

Original languageEnglish (US)
Pages (from-to)1620-1629
Number of pages10
JournalIEEE Transactions on Components, Packaging and Manufacturing Technology
Volume6
Issue number11
DOIs
StatePublished - Nov 2016

Keywords

  • Conjugate heat transfer
  • domain decomposition
  • finite element method (FEM)
  • integrated circuits (ICs)
  • microchannel
  • multiphysics

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Industrial and Manufacturing Engineering
  • Electrical and Electronic Engineering

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