Multiphysics simulation for the reliability analysis of large-scale interconnects

Tianjian Lu, Jianming Jin

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A coupled electrical-thermal-mechanical simulation technique is developed for the reliability analysis of interconnects. The multi-physics simulation is based on the finite element method and characterizes electrical, thermal, and mechanical, aspects of interconnects simultaneously. The multi-physics simulation is capable of analyzing large-scale problems with a significantly enhanced computational efficiency. The efficiency enhancement is achieved by using a domain decomposition scheme called the finite element tearing and interconnecting, parallel computing, and the localized nature of thermal stresses. A numerical example is provided to demonstrate both the capability and efficiency of the proposed simulation.

Original languageEnglish (US)
Title of host publication2016 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages215-217
Number of pages3
ISBN (Electronic)9781509061846
DOIs
StatePublished - Apr 5 2017
Event2016 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016 - Honolulu, United States
Duration: Dec 14 2016Dec 16 2016

Other

Other2016 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016
CountryUnited States
CityHonolulu
Period12/14/1612/16/16

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Modeling and Simulation

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  • Cite this

    Lu, T., & Jin, J. (2017). Multiphysics simulation for the reliability analysis of large-scale interconnects. In 2016 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016 (pp. 215-217). [7893167] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EDAPS.2016.7893167