Multiphysics simulation for the reliability analysis of large-scale interconnects

Tianjian Lu; Jian Ming Jin

doi:10.1109/EDAPS.2016.7893167

Multiphysics simulation for the reliability analysis of large-scale interconnects

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

A coupled electrical-thermal-mechanical simulation technique is developed for the reliability analysis of interconnects. The multi-physics simulation is based on the finite element method and characterizes electrical, thermal, and mechanical, aspects of interconnects simultaneously. The multi-physics simulation is capable of analyzing large-scale problems with a significantly enhanced computational efficiency. The efficiency enhancement is achieved by using a domain decomposition scheme called the finite element tearing and interconnecting, parallel computing, and the localized nature of thermal stresses. A numerical example is provided to demonstrate both the capability and efficiency of the proposed simulation.

Original language	English (US)
Title of host publication	2016 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	215-217
Number of pages	3
ISBN (Electronic)	9781509061846
DOIs	https://doi.org/10.1109/EDAPS.2016.7893167
State	Published - Apr 5 2017
Event	2016 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016 - Honolulu, United States Duration: Dec 14 2016 → Dec 16 2016

Publication series

Name	2016 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016

Other

Other	2016 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016
Country/Territory	United States
City	Honolulu
Period	12/14/16 → 12/16/16

ASJC Scopus subject areas

Electrical and Electronic Engineering
Electronic, Optical and Magnetic Materials
Modeling and Simulation

Online availability

10.1109/EDAPS.2016.7893167

Library availability

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Lu, T., & Jin, J. M. (2017). Multiphysics simulation for the reliability analysis of large-scale interconnects. In 2016 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016 (pp. 215-217). Article 7893167 (2016 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EDAPS.2016.7893167

Multiphysics simulation for the reliability analysis of large-scale interconnects. / Lu, Tianjian; Jin, Jian Ming.
2016 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016. Institute of Electrical and Electronics Engineers Inc., 2017. p. 215-217 7893167 (2016 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Lu, T & Jin, JM 2017, Multiphysics simulation for the reliability analysis of large-scale interconnects. in 2016 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016., 7893167, 2016 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016, Institute of Electrical and Electronics Engineers Inc., pp. 215-217, 2016 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016, Honolulu, United States, 12/14/16. https://doi.org/10.1109/EDAPS.2016.7893167

Lu T, Jin JM. Multiphysics simulation for the reliability analysis of large-scale interconnects. In 2016 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016. Institute of Electrical and Electronics Engineers Inc. 2017. p. 215-217. 7893167. (2016 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016). doi: 10.1109/EDAPS.2016.7893167

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Multiphysics simulation for the reliability analysis of large-scale interconnects

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