Abstract
The thermal analysis is coupled with the full-wave electromagnetic analysis in order to accurately predict the electrical behaviors of through-silicon-via (TSV) structures. The cosimulation is implemented with the finite element method. A highly efficient domain decomposition scheme is introduced into the co-simulation to handle large-scale massively coupled TSV structures.
| Original language | English (US) |
|---|---|
| Title of host publication | 2015 31st International Review of Progress in Applied Computational Electromagnetics, ACES 2015 |
| Publisher | Applied Computational Electromagnetics Society (ACES) |
| ISBN (Electronic) | 9780996007818 |
| State | Published - May 15 2015 |
| Event | 31st International Review of Progress in Applied Computational Electromagnetics, ACES 2015 - Williamsburg, United States Duration: Mar 22 2015 → Mar 26 2015 |
Publication series
| Name | Annual Review of Progress in Applied Computational Electromagnetics |
|---|---|
| Volume | 2015-May |
Other
| Other | 31st International Review of Progress in Applied Computational Electromagnetics, ACES 2015 |
|---|---|
| Country | United States |
| City | Williamsburg |
| Period | 3/22/15 → 3/26/15 |
Keywords
- Finite element tearing and interconnecting multiphysics
- Through-silicon-via
ASJC Scopus subject areas
- Electrical and Electronic Engineering
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Cite this
Lu, T., Jin, J., & Li, E. P. (2015). Multiphysics characterization of large-scale through-silicon-via structures. In 2015 31st International Review of Progress in Applied Computational Electromagnetics, ACES 2015 [7109635] (Annual Review of Progress in Applied Computational Electromagnetics; Vol. 2015-May). Applied Computational Electromagnetics Society (ACES).