@inproceedings{9b6c6e2941344791aaf92d661f6375a1,
title = "Multiphysics characterization of large-scale through-silicon-via structures",
abstract = "The thermal analysis is coupled with the full-wave electromagnetic analysis in order to accurately predict the electrical behaviors of through-silicon-via (TSV) structures. The cosimulation is implemented with the finite element method. A highly efficient domain decomposition scheme is introduced into the co-simulation to handle large-scale massively coupled TSV structures.",
keywords = "Finite element tearing and interconnecting multiphysics, Through-silicon-via",
author = "Tianjian Lu and Jin, {Jian Ming} and Li, {Er Ping}",
year = "2015",
month = may,
day = "15",
language = "English (US)",
series = "Annual Review of Progress in Applied Computational Electromagnetics",
publisher = "Applied Computational Electromagnetics Society (ACES)",
booktitle = "2015 31st International Review of Progress in Applied Computational Electromagnetics, ACES 2015",
note = "31st International Review of Progress in Applied Computational Electromagnetics, ACES 2015 ; Conference date: 22-03-2015 Through 26-03-2015",
}