Abstract

A method of bonding layers to form a structure, comprises curing a first adhesive while squeezing a first layer and a multilayer structure together between a first backing and a second backing. The multilayer structure comprises a substrate and a second layer, and the first adhesive is between and in contact with the first layer and the second layer. Furthermore, the first layer and the second layer each have a thickness of at most 100 μm, and at least one of the first backing and the second backing comprises a first elastic polymer.
Original languageEnglish (US)
U.S. patent number7445027
StatePublished - Nov 4 2008

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