TY - JOUR
T1 - Multifunctional Materials Strategies for Enhanced Safety of Wireless, Skin-Interfaced Bioelectronic Devices
AU - Liu, Claire
AU - Kim, Jin Tae
AU - Yang, Da Som
AU - Cho, Donghwi
AU - Yoo, Seonggwang
AU - Madhvapathy, Surabhi R.
AU - Jeong, Hyoyoung
AU - Yang, Tianyu
AU - Luan, Haiwen
AU - Avila, Raudel
AU - Park, Jihun
AU - Wu, Yunyun
AU - Bryant, Kennedy
AU - Cho, Min
AU - Lee, Ji Yong
AU - Kwak, Jay Young
AU - Ryu, Won Hyoung
AU - Huang, Yonggang
AU - Nuzzo, Ralph G.
AU - Rogers, John A.
N1 - C.L., J.‐T.K., D.S.Y., and D. C. contributed equally to this work. C.L., S.R.M., and R.A. acknowledge funding support from the National Science Foundation Graduate Research Fellowship Program (NSF DGE‐1842165). R.A. acknowledges funding support from the Ford Foundation Predoctoral Fellowship. This work made use of the Keck‐II facility and the NUFAB facility of Northwestern University's NUANCE Center, which has received support from the SHyNE Resource (NSF ECCS‐2025633), the IIN, and Northwestern's MRSEC program (NSF DMR‐1720139). Engineering efforts were supported by the Querrey Simpson Institute for Bioelectronics at Northwestern University. The authors gratefully acknowledge Seojin Yoo for her contributions to this work. Additional research support was provided by the Korea Research Institute of Chemical Technology (KRICT) of the Republic of Korea (KS2321‐10).
PY - 2023/8/22
Y1 - 2023/8/22
N2 - Many recently developed classes of wireless, skin-interfaced bioelectronic devices rely on conventional thermoset silicone elastomer materials, such as poly(dimethylsiloxane) (PDMS), as soft encapsulating structures around collections of electronic components, radio frequency antennas and, commonly, rechargeable batteries. In optimized layouts and device designs, these materials provide attractive features, most prominently in their gentle, noninvasive interfaces to the skin even at regions of high curvature and large natural deformations. Past studies, however, overlook opportunities for developing variants of these materials for multimodal means to enhance the safety of the devices against failure modes that range from mechanical damage to thermal runaway. This study presents a self-healing PDMS dynamic covalent matrix embedded with chemistries that provide thermochromism, mechanochromism, strain-adaptive stiffening, and thermal insulation, as a collection of attributes relevant to safety. Demonstrations of this materials system and associated encapsulation strategy involve a wireless, skin-interfaced device that captures mechanoacoustic signatures of health status. The concepts introduced here can apply immediately to many other related bioelectronic devices.
AB - Many recently developed classes of wireless, skin-interfaced bioelectronic devices rely on conventional thermoset silicone elastomer materials, such as poly(dimethylsiloxane) (PDMS), as soft encapsulating structures around collections of electronic components, radio frequency antennas and, commonly, rechargeable batteries. In optimized layouts and device designs, these materials provide attractive features, most prominently in their gentle, noninvasive interfaces to the skin even at regions of high curvature and large natural deformations. Past studies, however, overlook opportunities for developing variants of these materials for multimodal means to enhance the safety of the devices against failure modes that range from mechanical damage to thermal runaway. This study presents a self-healing PDMS dynamic covalent matrix embedded with chemistries that provide thermochromism, mechanochromism, strain-adaptive stiffening, and thermal insulation, as a collection of attributes relevant to safety. Demonstrations of this materials system and associated encapsulation strategy involve a wireless, skin-interfaced device that captures mechanoacoustic signatures of health status. The concepts introduced here can apply immediately to many other related bioelectronic devices.
KW - composite materials
KW - safety
KW - soft electronics
KW - stimuli-responsive
KW - wireless wearables
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U2 - 10.1002/adfm.202302256
DO - 10.1002/adfm.202302256
M3 - Article
AN - SCOPUS:85159090454
SN - 1616-301X
VL - 33
JO - Advanced Functional Materials
JF - Advanced Functional Materials
IS - 34
M1 - 2302256
ER -